18235169. THERMAL IMPROVEMENTS FOR MEMORY SUB-SYSTEMS simplified abstract (Micron Technology, Inc.)
Contents
THERMAL IMPROVEMENTS FOR MEMORY SUB-SYSTEMS
Organization Name
Inventor(s)
Suresh Reddy Yarragunta of Bangalore (IN)
Deepu Narasimiah Subhash of Yeshwanthpu (IN)
Ramesh Nallavelli of Sangareddy (IN)
THERMAL IMPROVEMENTS FOR MEMORY SUB-SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18235169 titled 'THERMAL IMPROVEMENTS FOR MEMORY SUB-SYSTEMS
Simplified Explanation
- Memory sub-systems in high temperature and low airflow environments may experience thermal throttling to limit throughput when a certain temperature is reached. - Adding a phase-change material with a melting temperature above ambient but below the thermal throttling temperature can increase the heat dissipation capacity of the memory sub-system. - Thermally coupling components with a heat spreading sheet can help distribute heat more evenly and prevent any single component from reaching the thermal throttling temperature too quickly.
Potential Applications
- Data centers - Industrial control systems - Automotive electronics
Problems Solved
- Preventing thermal throttling in memory sub-systems operating in high temperature and low airflow environments - Improving heat dissipation capacity of memory sub-systems
Benefits
- Increased operational time without thermal throttling - Enhanced reliability and performance of memory sub-systems - Cost-effective solution for managing heat in challenging environments
Original Abstract Submitted
Some memory sub-systems are operated in high temperature and low airflow environments. As a safeguard, thermal throttling may limit throughput on a memory sub-system when a predetermined temperature is reached or exceeded. Improving heat dissipation increases the amount of time a memory sub-system can operate without initiating thermal throttling. Adding a phase-change material (PCM) with a melting temperature above the ambient temperature but below the thermal throttling temperature to a memory sub-system increases the amount of heat the memory sub-system can generate before the temperature reaches the thermal throttling temperature. Thermally coupling components with a heat spreading sheet causes the temperature of the components to vary less than when the components transfer heat by air. Thus, a component that generates less heat may be used to absorb heat generated by another component, increasing the amount of time before any component reaches the thermal throttling temperature.
