17943104. TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE simplified abstract (Micron Technology, Inc.)
Contents
- 1 TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE
Organization Name
Inventor(s)
Ameen D. Akel of Rancho Cordova CA (US)
TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17943104 titled 'TIGHTLY-COUPLED RANDOM ACCESS MEMORY INTERFACE SHIM DIE
Simplified Explanation
The abstract describes an interface shim layer for a tightly-coupled random access memory device that redirects and coalesces integrated channels and connections between memory die and an application specific integrated circuit.
- The interface shim layer directly connects to the memory die and the application specific integrated circuit.
- The passive version of the interface shim layer includes routing layers for signal routing.
- The active version of the interface shim layer has separate physical interfaces for memory die and the application specific integrated circuit, and may include memory controller functions and self-test circuits.
Potential Applications
This technology could be applied in high-performance computing systems, data centers, and other applications requiring efficient communication between memory and processing units.
Problems Solved
This innovation solves the problem of optimizing communication and data transfer between stacked memory die and application specific integrated circuits in a tightly-coupled configuration.
Benefits
The interface shim layer improves data transfer efficiency, reduces latency, and enhances overall system performance in tightly-coupled memory configurations.
Potential Commercial Applications
The technology could be utilized in servers, supercomputers, artificial intelligence systems, and other high-performance computing applications.
Possible Prior Art
Prior art may include similar interface solutions for memory and processing unit communication, but the specific implementation of a tightly-coupled interface shim layer as described in this patent application may be novel.
Unanswered Questions
How does this technology compare to existing memory interface solutions in terms of performance and efficiency?
This article does not provide a direct comparison with existing memory interface solutions, leaving the reader to wonder about the specific advantages of this technology over current options.
What are the potential challenges or limitations of implementing this interface shim layer in practical systems?
The article does not address any potential challenges or limitations that may arise when implementing this technology, leaving room for speculation on the practicality of its deployment.
Original Abstract Submitted
An interface shim layer for a tightly-coupled random access memory device is disclosed. The interface shim layer redirects and coalesces integrated channels and connections between a stacked plurality of memory die and an application specific integrated circuit and directly connects to the memory die and to the application specific integrated circuit. A passive version of the interface shim layer incorporates a plurality of routing layers to facilitate routing of signals to and from the stacked plurality of memory die and the application specific integrated circuit. An active version of the interface shim layer incorporates separate physical interfaces for both the stacked plurality of memory die and the application specific integrated circuit to facilitate routing. The active version of the interface shim layer may further incorporate memory controller functions, built-in self-test circuits, among other capabilities that are migratable into the active interface shim layer.
