17940822. Image Sensor with Analog Inference Capability simplified abstract (Micron Technology, Inc.)
Contents
Image Sensor with Analog Inference Capability
Organization Name
Inventor(s)
Image Sensor with Analog Inference Capability - A simplified explanation of the abstract
This abstract first appeared for US patent application 17940822 titled 'Image Sensor with Analog Inference Capability
Simplified Explanation
The integrated circuit device described in the abstract consists of three integrated circuit dies: one with an image sensing pixel array, one with image processing and inference logic circuits, and one with a memory cell array. The inference logic circuit processes images from the pixel array using multiplication and accumulation operations based on memory cells with programmed threshold voltages.
- Image sensing pixel array on the first integrated circuit die
- Image processing and inference logic circuits on the second integrated circuit die
- Memory cell array on the third integrated circuit die
- Direct bond interconnect connecting the second and third integrated circuit dies
- Inference logic circuit processes images using multiplication and accumulation operations
- Memory cells store data in multiplications and output currents for summations
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- Potential Applications
This technology could be applied in:
- Image processing applications
- Artificial intelligence systems
- Surveillance systems
- Medical imaging devices
- Problems Solved
This technology addresses the following issues:
- Efficient image processing
- Enhanced inference logic capabilities
- Improved memory cell performance
- Benefits
The benefits of this technology include:
- Faster image processing speeds
- Higher accuracy in inference logic operations
- Compact design with integrated functionalities
- Potential Commercial Applications
This technology has potential in various commercial sectors, including:
- Consumer electronics
- Automotive industry
- Healthcare technology
- Security and surveillance systems
- Possible Prior Art
One possible prior art for this technology could be the use of separate integrated circuit dies for image sensing, processing, and memory functions in other electronic devices.
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- Unanswered Questions
- How does this technology compare to existing image processing systems?
This article does not provide a direct comparison to other image processing systems in terms of performance, efficiency, or cost-effectiveness.
- What are the limitations of this integrated circuit device?
The article does not mention any potential limitations or drawbacks of this technology, such as power consumption, scalability, or compatibility with other systems.
Original Abstract Submitted
An integrated circuit device including: a first integrated circuit die having an image sensing pixel array; a second integrated circuit die having an image processing logic circuit and an inference logic circuit; and a third integrated circuit die having a memory cell array. The second integrated circuit die and the third integrated circuit die are connected via a direct bond interconnect. The inference logic circuit is configured to process an image from the image sensing pixel array via multiplication and accumulation operations based on memory cells in the memory cell array having threshold voltages programmed to store data in multiplications and output currents from the memory cells connected to lines in summations.
