17899577. SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)

SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME

Organization Name

Micron Technology, Inc.

Inventor(s)

Thiagarajan Raman of Boise ID (US)

SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17899577 titled 'SEMICONDUCTOR DEVICE ASSEMBLIES HAVING FACE-TO-FACE SUBASSEMBLIES, AND METHODS FOR MAKING THE SAME

Simplified Explanation

The semiconductor device assembly includes two subassemblies with substrates, semiconductor dies, and interconnect structures.

• Substrates form opposing outer sides of the assembly.
• Interconnect structures are directly coupled to each other on the inside surface of the substrates.
• Die stacks are shorter than the interconnect structures and can also be on the inside surface of the substrates.
• Encapsulant material, different from the dielectric material, partially encapsulates the stacks and interconnect structures.

• • Potential Applications:**

- Semiconductor manufacturing - Electronics industry - Communication technology

• • Problems Solved:**

- Improved connectivity between semiconductor devices - Enhanced structural integrity of semiconductor assemblies

• • Benefits:**

- Increased reliability of semiconductor devices - Improved performance of electronic systems - Simplified assembly process for semiconductor devices

Original Abstract Submitted

A semiconductor device assembly having face-to-face subassemblies is provided. The assembly includes a first and second semiconductor device subassembly. Both subassemblies include a substrate, a stack of semiconductor dies, and an interconnect structure. The interconnect structures include a conductive pillar surrounded by dielectric material. Both substrates form opposing outer sides of the assembly, while the interconnect structures are disposed on the inside surface of their respective substrates and are directly coupled to one another. The die stacks are shorter than their respective interconnect structures, and therefore can also be disposed on the inside surface of their respective substrates. An encapsulant material—comprising a different material than the dielectric material—at least partially encapsulates the stacks and the interconnect structures.