17899574. SEMICONDUCTOR DEVICE WITH A POLYMER LAYER simplified abstract (Micron Technology, Inc.)
Contents
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 17899574 titled 'SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
Simplified Explanation
The patent application discloses a semiconductor device with a polymer layer that includes two semiconductor dies. The first die has circuitry and contact pads on one side, with a layer of polymer material on the opposite side. The second die has circuitry and interconnect structures on one side, with a passivation layer directly bonded to the polymer layer of the first die.
- Semiconductor device with a polymer layer
- Two semiconductor dies with different functionalities
- Polymer layer on one die with contact pads and openings
- Interconnect structures on the other die extending into the openings
- Passivation layer directly bonded to the polymer layer for reliable coupling
Potential Applications
- Semiconductor manufacturing
- Electronic devices
- Integrated circuits
Problems Solved
- Improved reliability in coupling semiconductor dies
- Enhanced functionality in semiconductor devices
- Better protection for circuitry and contact pads
Benefits
- Increased performance in electronic devices
- Enhanced durability and longevity of semiconductor assemblies
- Improved manufacturing processes for semiconductor devices
Original Abstract Submitted
This document discloses techniques, apparatuses, and systems for a semiconductor device with a polymer layer. A semiconductor assembly is described that includes two semiconductor dies. The first semiconductor die has a first active side with first circuitry and a first back side opposite the first active side. Contact pads and a layer of polymer material are disposed at the first back side such that the layer of polymer material includes openings that expose the contact pads. The second semiconductor die has second circuitry disposed at a second active side. Interconnect structures are also disposed at the second active side such that the interconnect structures extend into the openings and couple to contact pads. A passivation layer (e.g., dielectric material) is disposed at the second active side and directly bonded to the layer of polymer material to reliably couple the two semiconductor dies.
