17899522. SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SPACERS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract (Micron Technology, Inc.)
Contents
- 1 SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SPACERS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SPACERS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SPACERS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS
Organization Name
Inventor(s)
Bong Woo Choi of Singapore (SG)
Venkateswarlu Bhavanasi of Singapore (SG)
Harjashan Veer Singh of San Jose CA (US)
SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SPACERS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17899522 titled 'SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SPACERS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS
Simplified Explanation
- Substrates with spacers, including solder resist spacers, are disclosed in this patent application. - The substrate includes a solder resist layer, electrical contacts, and a solder resist spacer. - The solder resist spacer is designed to limit bleed out of underfill away from the electrical contacts. - The spacer can have a height corresponding to the thickness of the electronic device. - The spacer acts as a dam to prevent lateral spread of underfill towards the electrical contacts.
Potential Applications
- Electronic devices manufacturing - Circuit board assembly
Problems Solved
- Preventing bleed out of underfill towards electrical contacts - Ensuring proper alignment and connection between substrate and electronic device
Benefits
- Improved reliability of electronic devices - Enhanced performance of circuit boards - Simplified manufacturing processes
Original Abstract Submitted
Substrates with spacers, including substrates with solder resist spacers, and associated devices, systems, and methods are disclosed herein. In one embodiment, a substrate comprises a first surface, a solder resist layer disposed over at least a portion of the first surface, and a plurality of electrical contacts at the first surface of the substrate. Electrical contacts of the plurality are configured to be coupled to corresponding electrical contacts at a surface of an electronic device. The substrate further includes a solder resist spacer disposed on the solder resist layer. The solder resist spacer can have a height corresponding to a thickness of the electronic device. The solder resist spacer can be configured as a dam to limit bleed out of underfill laterally away from the plurality of electrical contacts along the first surface and toward the solder resist spacer.
