17898368. SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
Contents
SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED METHODS
Organization Name
Inventor(s)
Chin Hui Chong of Singapore (SG)
Suresh K. Upadhyayula of San Jose CA (US)
SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17898368 titled 'SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED METHODS
Simplified Explanation
The assembly described in the abstract consists of a substrate with two bond pads at the top surface and a semiconductor die with bond pads on its upper surface.
- The first and second bond pads on the substrate are at different distances from the side surface.
- The third and fourth bond pads on the semiconductor die are also at different distances from the side surface.
- The sum of the distances between the first and third bond pads is equal to the sum of the distances between the second and fourth bond pads.
- A first wire connects the first and third bond pads, while a second wire connects the second and fourth bond pads.
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- Potential Applications
- Semiconductor packaging
- Integrated circuits
- Microelectronics
- Problems Solved
- Efficient bonding of semiconductor die to substrate
- Precise wire connections between bond pads
- Benefits
- Improved electrical connections
- Enhanced reliability
- Compact design for electronic devices
Original Abstract Submitted
An assembly comprising a substrate with a first and second bond pad at a top surface; and a semiconductor die with a lower surface coupled to the top surface, an upper surface with a third and fourth bond pad thereat, and a side surface perpendicular to the upper and lower surfaces. The first bond pad can be a first distance, the second bond pad can be a second distance, the third bond pad can be a third distance, and the fourth bond pad can be a fourth distance, respectively, from the side surface. The first and third distances summed can be the same as the second and fourth distances summed. A first wire can extend between the first and third bond pads, and a second wire can extend between the second and fourth bond pads.
