17897516. Memory Circuitry And Method Used In Forming Memory Circuitry simplified abstract (Micron Technology, Inc.)
Contents
Memory Circuitry And Method Used In Forming Memory Circuitry
Organization Name
Inventor(s)
John D. Hopkins of Meridian ID (US)
Alyssa N. Scarbrough of Boise ID (US)
Memory Circuitry And Method Used In Forming Memory Circuitry - A simplified explanation of the abstract
This abstract first appeared for US patent application 17897516 titled 'Memory Circuitry And Method Used In Forming Memory Circuitry
Simplified Explanation
- Memory circuitry with strings of memory cells - Stack with alternating insulative tiers and conductive tiers - Memory-array region with channel-material strings of memory cells - Stair-step region with a flight of stairs along one direction - Multiple different-depth treads in the stairs extending along another direction - Treads made of conducting material from the conductive tiers - First and second flights of treads facing towards each other - Landing lower in the stack than the treads
- Potential Applications:**
- Memory storage devices - Computer systems - Data centers
- Problems Solved:**
- Efficient memory storage - Improved data processing speed - Space-saving design
- Benefits:**
- Increased memory capacity - Enhanced data transfer rates - Compact and scalable memory circuitry
Original Abstract Submitted
Memory circuitry comprising strings of memory cells comprises a stack comprising vertically-alternating insulative tiers and conductive tiers. Channel-material strings of memory cells extend through the insulative tiers and the conductive tiers in a memory-array region. The insulative tiers and the conductive tiers extend from the memory-array region into a stair-step region. The stair-step region comprises a flight of stairs extending along a first direction. Multiple different-depth treads in individual of the stairs extend along a second direction that is orthogonal to the first direction. Individual of the multiple different-depth treads comprise conducting material of one of the conductive tiers. The multiple different-depth treads in the individual stairs comprise a first flight of the treads and a second flight of the treads. A landing is between and lower in the stack than each of the first and second flights of treads. The first and second flights of treads in the second direction face toward one another. Methods are disclosed.
