17896030. EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES simplified abstract (Micron Technology, Inc.)
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
Organization Name
Inventor(s)
Kelvin Tan Aik Boo of Singapore (SG)
See Hiong Leow of Singapore (SG)
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17896030 titled 'EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
Simplified Explanation
The semiconductor device assembly described in the abstract includes a semiconductor device with pillars on the backside surface, and a substrate with extended bond pads on the front side surface, directly attached to the semiconductor device with solder connections.
- Semiconductor device assembly with pillars on backside surface of semiconductor device
- Substrate with solder mask layer and extended bond pads on front side surface
- Direct attachment of semiconductor device to substrate by bonding pillars to extended bond pads with solder connection
Potential Applications
- Electronics manufacturing
- Semiconductor packaging
- Microelectronics industry
Problems Solved
- Improved bonding between semiconductor device and substrate
- Enhanced reliability of connections
- Efficient heat dissipation
Benefits
- Stronger bond between semiconductor device and substrate
- Better performance and reliability
- Simplified assembly process
Original Abstract Submitted
A semiconductor device assembly including a semiconductor device having a plurality of pillars disposed on a backside surface of the semiconductor device; and a substrate, including: a solder mask layer disposed on a front side surface of the substrate, a plurality of extended bond pads disposed on the frontside surface of the substrate and surrounded by the solder mask layer, the plurality of extended bond pads each having a top surface higher than a top surface of the solder mask layer, and wherein the semiconductor device is directly attached to the substrate by bonding each of the plurality of pillars of the semiconductor device to the top surface of a corresponding one of the plurality of extended bond pads with a solder connection.
