17893941. SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS simplified abstract (Micron Technology, Inc.)
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
Organization Name
Inventor(s)
Raj K. Bansal of Boise ID (US)
SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17893941 titled 'SEMICONDUCTOR DEVICES, ASSEMBLIES, AND ASSOCIATED METHODS
Simplified Explanation
- A semiconductor device assembly includes an assembly substrate with a die stack on top. - The die stack consists of a first and a second die, each with a die substrate having top and bottom surfaces. - The top surface of each die has a first region a certain distance from the bottom surface, and a second region further away with a bond pad. - The bottom surface of the first die bonds with the assembly substrate, while the bottom surface of the second die bonds with the first region of the first die's top surface. - Additional die stacks and/or dies can be included in the assembly.
Potential Applications
- Semiconductor manufacturing - Electronics industry - Integrated circuit production
Problems Solved
- Efficient bonding of multiple dies in a semiconductor device assembly - Improved connectivity between different components in the assembly
Benefits
- Increased functionality in semiconductor devices - Enhanced performance and reliability - Simplified manufacturing processes
Original Abstract Submitted
A semiconductor device assembly can include an assembly substrate having a top surface with a die stack thereat. The die stack can include a first and a second die, and each dies can include a die substrate with a top and a bottom surface. The top surface can include a first region a first distance from the bottom surface, and a second region a second distance, greater than the first distance, from the bottom surface and with a bond pad thereat. The bottom surface of the first die can bond with the top surface of the assembly substrate, and the bottom surface of the second die can bond with the first region of the first die top surface. In some embodiments, the assembly can further include additional die stacks and/or additional dies within one or more die stacks.
