17887372. REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE simplified abstract (Micron Technology, Inc.)

REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE

Organization Name

Micron Technology, Inc.

Inventor(s)

Vijayakrishna J. Vankayala of Allen TX (US)

REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17887372 titled 'REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE

Simplified Explanation

The patent application describes techniques for repeating inter-die signals within a multi-die package of a memory device.

• A multi-die package includes a memory stack with a first memory die and at least one second memory die connected via an inter-die connection.
• A multiplexer is placed in front of the transmitter of each die to repeat inter-die signals within the memory stack.
• The repetition of signals is determined based on factors like signal type, intended recipient, and stack height of the memory stack.

Potential Applications

• Memory devices in electronic devices like smartphones, tablets, and computers.
• Data centers and servers that require high-performance memory systems.

Problems Solved

• Ensures reliable communication between memory dies within a multi-die package.
• Helps overcome signal degradation and loss due to inter-die connections.
• Improves overall performance and data transfer rates in memory devices.

Benefits

• Enhanced signal integrity and reliability within the memory stack.
• Improved data transfer rates and overall performance of the memory device.
• Enables efficient communication between memory dies in a multi-die package.

Original Abstract Submitted

Systems, methods, and devices related to techniques for repeating inter-die signals within a multi-die package of a memory device are disclosed. The multi-die package includes a memory stack including a first memory die handling interfacing with a host for the package and at least one second memory die coupled to and configured to communicate with the first memory die via an inter-die connection. A technique involves incorporating the use of a multiplexer positioned in front of the transmitter of each die to facilitate repetition of inter-die signals within the memory stack as needed depending on various factors associated with the memory stack, such as, but not limited to, the type of signal, the intended recipient of the inter-die signals, and the stack height of the memory stack.