17856691. ADAPTIVE TEMPERATURE COMPENSATION FOR A MEMORY DEVICE simplified abstract (Micron Technology, Inc.)

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ADAPTIVE TEMPERATURE COMPENSATION FOR A MEMORY DEVICE

Organization Name

Micron Technology, Inc.

Inventor(s)

Vamsi Pavan Rayaprolu of Santa Clara CA (US)

Steven Michael Kientz of Westminster CO (US)

ADAPTIVE TEMPERATURE COMPENSATION FOR A MEMORY DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17856691 titled 'ADAPTIVE TEMPERATURE COMPENSATION FOR A MEMORY DEVICE

Simplified Explanation

The abstract describes a patent application that involves analyzing the performance of each die in a multi-die memory device and determining a temperature compensation value for each die based on the number of program erase cycles. This compensation value is then used to process memory access requests for each die. The patent application also includes a method to update the compensation equation based on a second analysis of each die.

  • The patent application involves analyzing the performance of individual dies in a multi-die memory device.
  • A temperature compensation value is determined for each die based on the number of program erase cycles.
  • The compensation value is used to process memory access requests for each die.
  • The patent application includes a method to update the compensation equation based on a second analysis of each die.

Potential Applications

  • This technology can be applied in the field of memory devices, particularly multi-die memory devices.
  • It can be used in various electronic devices that rely on memory storage, such as computers, smartphones, and tablets.

Problems Solved

  • The technology addresses the issue of temperature variations affecting the performance of individual dies in a multi-die memory device.
  • By determining temperature compensation values for each die, the technology ensures more accurate and reliable memory access processing.

Benefits

  • The technology improves the overall performance and reliability of multi-die memory devices.
  • It helps to mitigate the impact of temperature variations on memory access operations.
  • By updating the compensation equation based on analysis, the technology can adapt to changing conditions and optimize memory access processing.


Original Abstract Submitted

A first analysis of each respective die of a multi-die memory device is performed. An equation to determine a respective temperature compensation (tempco) value for each respective die based on a number of program erase cycles (PECs) of the respective die based on the first analysis s determined. The equation for use in processing memory access requests directed to the respective die is stored. Whether to update the equation directed to the respective die based on a second analysis of the respective die is determined.

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