17821871. HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
Contents
- 1 HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS
Organization Name
Inventor(s)
Charles E. Siko of Boise ID (US)
Kaleb A. Wilson of Caldwell ID (US)
Bradley R. Bitz of Boise ID (US)
HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17821871 titled 'HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS
Simplified Explanation
- Printed wiring board assembly with magnet structures, microelectronic device component, heat spreader, and posts - Magnet structures in physical contact with the printed wiring board - Microelectronic device component coupled to the first side of the printed wiring board - Heat spreader overlies and is in thermal communication with the microelectronic device component - Posts coupled to the heat spreader and horizontally neighbor the microelectronic device component - Posts are in magnetic communication with the magnet structures
Potential Applications
- Electronics manufacturing - Thermal management in electronic devices - Microelectronic device assembly
Problems Solved
- Efficient heat dissipation in microelectronic devices - Improved thermal communication between components - Enhanced magnetic communication for stability
Benefits
- Better performance and reliability of microelectronic devices - Enhanced thermal management capabilities - Increased efficiency in electronic systems
Original Abstract Submitted
A printed wiring board assembly is disclosed that includes a printed wiring board with a first side and a second side opposite first side. Magnet structures are in physical contact with the printed wiring board and a microelectronic device component is coupled to the first side of the printed wiring board. A heat spreader overlies and is in thermal communication with the microelectronic device component, and posts are coupled to the heat spreader and horizontally neighbor the microelectronic device component, where the posts are in magnetic communication with the magnet structures. Related methods and electronic systems are also disclosed.
