18499242. METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Mao-Yen Chang of Kaohsiung City (TW)

Chih-Wei Lin of Hsinchu County (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Kuo-Lung Pan of Hsinchu city (TW)

Chun-Cheng Lin of New Taipei City (TW)

Tin-Hao Kuo of Hsinchu City (TW)

Yu-Chia Lai of Miaoli County (TW)

Chih-Hsuan Tai of Taipei City (TW)

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18499242 titled 'METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

Simplified Explanation

The method involves bonding components onto a semiconductor wafer, with some components overhanging the wafer's periphery.

• Components are bonded onto a semiconductor wafer.
• Some components overhang the wafer's periphery.
• A barrier structure is formed between components and the wafer.
• An underfill structure is formed under certain components, with the barrier structure preventing spreading.

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1. 1. 1. Potential Applications

• Semiconductor manufacturing
• Electronics assembly

1. 1. 1. Problems Solved

• Preventing spreading of underfill material
• Ensuring proper bonding of components

1. 1. 1. Benefits

• Improved reliability of semiconductor structures
• Enhanced performance of electronic devices

Original Abstract Submitted

A method of fabricating a semiconductor structure includes the following steps. A semiconductor wafer is provided. A plurality of first surface mount components and a plurality of second surface mount components are bonded onto the semiconductor wafer, wherein a first portion of each of the second surface mount components is overhanging a periphery of the semiconductor wafer. A first barrier structure is formed in between the second surface mount components and the semiconductor wafer. An underfill structure is formed under a second portion of each of the second surface mount components, wherein the first barrier structure blocks the spreading of the underfill structure from the second portion to the first portion.