Western Digital Technologies, Inc. (20240243101). STACKED CHIP SCALE SEMICONDUCTOR DEVICE simplified abstract
Contents
STACKED CHIP SCALE SEMICONDUCTOR DEVICE
Organization Name
Western Digital Technologies, Inc.
Inventor(s)
Yoong Tatt Chin of Penang (MY)
STACKED CHIP SCALE SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240243101 titled 'STACKED CHIP SCALE SEMICONDUCTOR DEVICE
The abstract describes a patent application for a stacked chip scale semiconductor device that includes one or more semiconductor die stacks. Each stack may consist of a pair of semiconductor dies, with one die having contact pads for flip chip bonding and the other die having exposed contact pads.
- Pair of semiconductor dies in each stack
- First die with contact pads for flip chip bonding
- Second die with exposed contact pads
- Offset, stepped configuration of bonding
- Electrical coupling of contact pads through additive manufacturing or conductive trace printing
Potential Applications: - Advanced semiconductor devices - High-density integrated circuits - Miniaturized electronics
Problems Solved: - Enhancing connectivity in stacked semiconductor devices - Improving efficiency in chip scale packaging
Benefits: - Increased functionality in compact devices - Enhanced performance in semiconductor applications
Commercial Applications: Title: "Innovative Stacked Semiconductor Devices for Advanced Electronics" This technology can be utilized in various industries such as consumer electronics, telecommunications, and automotive for compact and high-performance electronic devices.
Questions about Stacked Chip Scale Semiconductor Devices: 1. How does the offset, stepped configuration of bonding contribute to the functionality of the semiconductor device? 2. What are the advantages of using additive manufacturing or conductive trace printing for electrical coupling in semiconductor devices?
Frequently Updated Research: Researchers are continually exploring new materials and manufacturing techniques to further improve the performance and efficiency of stacked chip scale semiconductor devices. Stay updated on the latest advancements in the field for potential breakthroughs in semiconductor technology.
Original Abstract Submitted
a stacked chip scale semiconductor device includes one or more semiconductor die stacks. each semiconductor die stack may include a pair of semiconductor dies. a first of the pair of semiconductor dies may be provided with a pattern of contact pads distributed across its major surface configured to be flip chip bonded to a host device. a second of the pair of semiconductor dies may include a row of contact pads. the first semiconductor die may be bonded on top of the second semiconductor die in an offset, stepped configuration so that the row of contact pads of the second semiconductor die is left exposed. like channels of contact pads on the first and second semiconductor dies may then be electrically coupled by additive manufacturing or conductive trace printing.
