Waymo llc (20240191715). Air Cooling System for Electronic Spinning Assembly simplified abstract
Air Cooling System for Electronic Spinning Assembly
Organization Name
Inventor(s)
Rutvik Acharya of San Jose CA (US)
Simon Ellgas of San Jose CA (US)
Benjamin Chen of San Francisco CA (US)
Air Cooling System for Electronic Spinning Assembly - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240191715 titled 'Air Cooling System for Electronic Spinning Assembly
Simplified Explanation: The patent application describes an air cooling system for an electronic spinning assembly, featuring vanes and a rotatable vane cover with air inlets, ducts, and choke points to increase airflow pressure.
- The invention is an air cooling system for an electronic spinning assembly.
- It includes vanes and a rotatable vane cover.
- The vane cover has air inlets, ducts, and choke points.
- The choke points are designed to boost airflow pressure.
Key Features and Innovation:
- Vanes and vane cover for air cooling in electronic spinning assembly.
- Air inlets, ducts, and choke points to enhance airflow pressure.
Potential Applications: The technology can be applied in electronic spinning assemblies, data centers, and other electronic equipment requiring efficient air cooling systems.
Problems Solved: The system addresses the need for effective air cooling in electronic spinning assemblies to prevent overheating and ensure optimal performance.
Benefits:
- Improved airflow pressure for better cooling.
- Enhanced performance and longevity of electronic spinning assemblies.
Commercial Applications: The technology can be utilized in electronic manufacturing industries, data centers, and server rooms to enhance cooling efficiency and prolong equipment lifespan.
Prior Art: Readers can explore prior patents related to air cooling systems for electronic equipment to understand the evolution of such technologies.
Frequently Updated Research: Stay updated on advancements in air cooling systems for electronic equipment to incorporate the latest innovations into the technology.
Questions about Air Cooling System for Electronic Spinning Assembly: 1. What are the key components of the air cooling system described in the patent application? 2. How does the technology improve airflow pressure in electronic spinning assemblies?
Original Abstract Submitted
example embodiments relate to an air cooling system for an electronic spinning assembly. an example embodiment includes a plurality of vanes coupled to a static base. a vane cover is rotatably coupled to the static base. the vane cover includes at least one air inlet, at least one air duct extending from the vane cover, and at least one choke point disposed in the cover. the at least one choke point is configured to increase a pressure of the airflow.