Unknown Organization (20240290681). INTEGRATED HYBRID HEAT SPREADER MANUFACTURING METHOD AND THEREOF simplified abstract
Contents
INTEGRATED HYBRID HEAT SPREADER MANUFACTURING METHOD AND THEREOF
Organization Name
Inventor(s)
SHUN-PING Huang of Hsinchu County (TW)
INTEGRATED HYBRID HEAT SPREADER MANUFACTURING METHOD AND THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240290681 titled 'INTEGRATED HYBRID HEAT SPREADER MANUFACTURING METHOD AND THEREOF
Simplified Explanation: The semiconductor package described in the patent application includes a die mounted on a substrate using flip-chip solder balls, an integrated hybrid heat spreader, a high temperature durable bonding material, a heat sink with vents, and a thermal interface material to dissipate heat generated by the die.
- The die is mounted on a substrate using flip-chip solder balls.
- An integrated hybrid heat spreader, consisting of a thin flexible perforated foil and a supporter, is bonded to the backside of the die.
- A heat sink is fixed and attached to the heat sink supporter, creating a cavity-like container portion with the integrated hybrid heat spreader and the exposed major portion of the die.
- A thermal interface material is applied within the cavity-like container portion to conduct heat from the die to the heat sink.
- The vents in the heat sink accommodate the expansion or shrinkage of the thermal interface material during thermal cycling.
Potential Applications: This technology can be used in various electronic devices and systems that require efficient heat dissipation, such as computers, servers, and mobile devices.
Problems Solved: The technology addresses the issue of heat buildup in semiconductor devices, which can affect performance and reliability.
Benefits: The benefits of this technology include improved thermal management, increased device performance, and enhanced reliability.
Commercial Applications: Title: Advanced Thermal Management System for Electronic Devices This technology can be commercialized in the electronics industry for applications in high-performance computing, telecommunications, and consumer electronics. It can improve the efficiency and reliability of electronic devices by effectively dissipating heat generated during operation.
Prior Art: Researchers and engineers can explore prior art related to thermal management systems in semiconductor devices, flip-chip bonding techniques, and heat sink designs to understand the evolution of this technology.
Frequently Updated Research: Researchers are continuously exploring new materials and manufacturing techniques to enhance the thermal performance of semiconductor packages and improve the reliability of electronic devices.
Questions about Semiconductor Package Technology: 1. How does the integrated hybrid heat spreader improve thermal management in semiconductor packages? 2. What are the potential challenges in implementing this advanced thermal management system in commercial electronic devices?
Original Abstract Submitted
a semiconductor package comprises a die mounted on a substrate by flip-chip solder balls; an integrated hybrid heat spreader including a thin flexible perforated foil and a supporter; a high temperature durable bonding material applied to the backside of the integrated hybrid heat spreader to bond the backside of the integrated hybrid heat spreader to the die; a heat sink fixed and attached to the heat sink supporter, wherein the backside of the heat sink is provided with vents and the backside of the heat sink, the integrated hybrid heat spreader and the exposed major portion of the die together define a cavity-like container portion; and a thermal interface material applied within the cavity-like container portion, wherein the heat generated from the die is conducted through the thermal interface material to the heat sink, and the vents in the heat sink can accommodate the expansion or shrinkage of the thermal interface material during thermal cycling. the thin flexible perforated foil is bonded onto the top of a silicon die by using the cold spray additive manufacturing method.
