US Patent Application 18324737. FORMING APPARATUS, FORMING METHOD, AND ARTICLE MANUFACTURING METHOD simplified abstract

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FORMING APPARATUS, FORMING METHOD, AND ARTICLE MANUFACTURING METHOD

Organization Name

CANON KABUSHIKI KAISHA==Inventor(s)==

[[Category:YOUSUKE Kondo of Tochigi (JP)]]

FORMING APPARATUS, FORMING METHOD, AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18324737 titled 'FORMING APPARATUS, FORMING METHOD, AND ARTICLE MANUFACTURING METHOD

Simplified Explanation

- The patent application describes a method for curing a curable composition on a substrate. - The method involves using two curing units: a first curing unit and a second curing unit. - If it is determined that forming processing can be performed, the curable composition is cured by the first curing unit while in contact with a member. - After curing, the member is separated from the curable composition. - The curable composition is then further cured by the second curing unit. - If it is determined that forming processing cannot be performed, the curable composition is directly cured by the second curing unit without being cured by the first curing unit. - This method prevents the carry-out of uncured composition on the substrate and contamination inside and outside the apparatus when normal processing cannot be performed.


Original Abstract Submitted

In a case where it is determined that forming processing can be performed, a curable composition on a substrate is cured by a first curing unit in a state where a member is in contact with the curable composition, the member is separated, and the curable composition is further cured by a second curing unit. In a case where it is determined that the forming processing cannot be performed, the curable composition is cured by the second curing unit in a state where the curable composition is separated from the member without the curable composition being cured by the first curing unit. This can prevent carry-out of the substrate to which an uncured composition is applied and contamination inside and outside an apparatus even in a case where normal processing cannot be performed.

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