US Patent Application 18299152. SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, ILLUMINATION DEVICE, MOVING BODY, AND WEARABLE DEVICE simplified abstract
Contents
- 1 SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, ILLUMINATION DEVICE, MOVING BODY, AND WEARABLE DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, ILLUMINATION DEVICE, MOVING BODY, AND WEARABLE DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Original Abstract Submitted
SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, ILLUMINATION DEVICE, MOVING BODY, AND WEARABLE DEVICE
Organization Name
Inventor(s)
KENGO Kobayashi of Kanagawa (JP)
SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, ILLUMINATION DEVICE, MOVING BODY, AND WEARABLE DEVICE - A simplified explanation of the abstract
- This abstract for appeared for US patent application number 18299152 Titled 'SEMICONDUCTOR DEVICE, LIGHT EMITTING DEVICE, DISPLAY DEVICE, PHOTOELECTRIC CONVERSION DEVICE, ELECTRONIC APPARATUS, ILLUMINATION DEVICE, MOVING BODY, AND WEARABLE DEVICE'
Simplified Explanation
The abstract describes a semiconductor device that includes an element substrate, a light transmissive substrate, a wiring board, and a reinforcing member. The element substrate has a terminal arranged on its first surface, which is connected to the second surface of the light transmissive substrate through a coupling member. The wiring board is connected to the terminal and the reinforcing member is used to strengthen the bond between the element substrate and the wiring board. The light transmissive substrate has a side surface with a chamfered fifth surface, which is in contact with the coupling member. The reinforcing member contacts the sixth surface of the wiring board, which is on the opposite side of the third surface.
Original Abstract Submitted
A semiconductor device including an element substrate having a first surface on which a terminal is arranged, a light transmissive substrate having a second surface that is coupled to the first surface via a coupling member, a wiring board having a third surface connected to the terminal, and a reinforcing member configured to reinforce bonding between the element substrate and the wiring board. The terminal is arranged along a first side of the first surface. A side surface of the light transmissive substrate includes a fourth surface arranged along the first side. A chamfered fifth surface is arranged between the second surface and the fourth surface. The coupling member contacts the fifth surface, and the reinforcing member contacts a sixth surface of the wiring board on an opposite side of the third surface, the peripheral region and the fourth surface.
