U.S. Army DEVCOM, Army Research Laboratory Patent Application Trends in 2025
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Contents
- 1 U.S. Army DEVCOM, Army Research Laboratory Patent Filing Activity
- 2 U.S. Army DEVCOM, Army Research Laboratory patent applications in 2025
- 3 Top 10 Technology Areas
- 4 Emerging Technology Areas
- 5 Top Inventors
- 6 Patent Categories
- 7 Geographical Distribution of Inventors
- 8 Geographical Distribution of US Inventors
U.S. Army DEVCOM, Army Research Laboratory Patent Filing Activity
U.S. Army DEVCOM, Army Research Laboratory patent applications in 2025
Top 10 Technology Areas
- C22C9/00 (Alloys based on copper)
- B22F2301/10 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- G10K11/162 (Methods or devices for protecting against, or for damping, noise or other acoustic waves in general ()
- G10K11/04 (SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR)
- B64U10/60 (Tethered aircraft)
- B64F3/02 (GROUND OR AIRCRAFT-CARRIER-DECK INSTALLATIONS SPECIALLY ADAPTED FOR USE IN CONNECTION WITH AIRCRAFT; DESIGNING, MANUFACTURING, ASSEMBLING, CLEANING, MAINTAINING OR REPAIRING AIRCRAFT, NOT OTHERWISE PROVIDED FOR; HANDLING, TRANSPORTING, TESTING OR INSPECTING AIRCRAFT COMPONENTS, NOT OTHERWISE PROVIDED FOR)
- B64U50/35 (UNMANNED AERIAL VEHICLES [UAV]; EQUIPMENT THEREFOR)
- H04N23/55 (PICTORIAL COMMUNICATION, e.g. TELEVISION)
- G02B27/281 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS)
- G06T7/13 (Edge detection)
Emerging Technology Areas
- B22F2999/00 (Aspects linked to processes or compositions used in powder metallurgy)
- B22F2998/10 (Processes characterised by the sequence of their steps)
- B22F2301/20 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F2301/054 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F2009/043 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- B22F2009/041 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- C22C1/0425 (by powder metallurgy ()
- B22F3/02 (WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER (making alloys by powder metallurgy)
- H05K2203/302 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240090126. LASER FOLDED 3D ELECTRONICS (U.S. Army DEVCOM, Army Research Laboratory)
- H05K2203/1105 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS)
- Count: 1 patents
- Example: 20240090126. LASER FOLDED 3D ELECTRONICS (U.S. Army DEVCOM, Army Research Laboratory)
Top Inventors
- Kristopher A. Darling of Havre de Grace MD (US) (2 patents)
- Billy C. Hornbuckle of Bel Air MD (US) (2 patents)
- Anthony J. Roberts of Chesapeake City MD (US) (2 patents)
- Anit K. Giri of Abingdon MD (US) (2 patents)
- Nathan S. Lazarus of Bear DE (US) (2 patents)
- Michael V. Scanlon of Laurel MD (US) (1 patent)
- James D. Humann of Los Angeles CA (US) (1 patent)
- Mahdi Al-Husseini of Enterprise AL (US) (1 patent)
- Joshua L. Barnett of Standord CA (US) (1 patent)
- Anthony Chen of Stanford CA (US) (1 patent)
Patent Categories
Geographical Distribution of Inventors
Geographical Distribution of US Inventors
Categories:
- U.S. Army DEVCOM, Army Research Laboratory
- Companies
- CPC G10K11/162
- CPC G10K11/04
- CPC B64U10/60
- CPC B64F3/02
- CPC B64U50/35
- CPC H04N23/55
- CPC G02B27/281
- CPC G06T7/13
- CPC H04N23/51
- CPC H04N23/53
- CPC H05K7/20336
- CPC H05K7/2039
- CPC C09K5/06
- CPC G02F1/19
- CPC H04B10/11
- CPC G02F2202/30
- CPC G02F2203/15
- CPC B22F1/054
- CPC B22F1/065
- CPC B82Y30/00
- CPC C22C9/00
- CPC B22F2301/10
- CPC B82Y40/00
- CPC H01G7/025
- CPC H04L63/10
- CPC H04L63/1491
- CPC C08G65/2603
- CPC C08K5/23
- CPC C08G59/24
- CPC C09K9/02
- CPC C09K2211/1007
- CPC C09K2211/1014
- CPC C25B9/21
- CPC C25B1/04
- CPC C25B11/063
- CPC C25B11/093
- CPC C25B13/02
- CPC C25B13/05
- CPC H05K1/028
- CPC H05K3/0026
- CPC H05K2201/055
- CPC H05K2203/1105
- CPC H05K2203/302
- CPC B22F3/02
- CPC C22C1/0425
- CPC B22F2009/041
- CPC B22F2009/043
- CPC B22F2301/054
- CPC B22F2301/20
- CPC B22F2998/10
- CPC B22F2999/00
- Patent Trends by Company in 2024