Toyota jidosha kabushiki kaisha (20240305213). POWER CONVERTER AND DRIVE DEVICE simplified abstract

POWER CONVERTER AND DRIVE DEVICE

Organization Name

toyota jidosha kabushiki kaisha

Inventor(s)

Keisuke Sawazaki of Nisshin-shi (JP)

POWER CONVERTER AND DRIVE DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240305213 titled 'POWER CONVERTER AND DRIVE DEVICE

The power converter described in this patent application includes a power module with at least one power semiconductor element, a metal plate in thermal connection with the power semiconductor element, and a flow path defining member made of plastic material that creates a coolant flow path along with the metal plate. Coolant flows through this path, and the flow path defining member is integrated into the metal plate.

• Power module with power semiconductor element
• Metal plate in thermal connection with the power semiconductor element
• Flow path defining member made of plastic material
• Coolant flow path created by the flow path defining member
• Integration of the flow path defining member into the metal plate

Potential Applications: - Power electronics - Renewable energy systems - Electric vehicles

Problems Solved: - Efficient cooling of power semiconductor elements - Integration of coolant flow path into the metal plate

Benefits: - Improved thermal management - Enhanced performance and reliability of power converters

Commercial Applications: Title: "Innovative Power Converter for Enhanced Thermal Management" This technology can be used in various commercial applications such as: - Industrial power supplies - Electric vehicle charging systems - Solar inverters

Questions about the technology: 1. How does the integration of the flow path defining member into the metal plate improve thermal management? 2. What are the potential cost implications of implementing this power converter technology in commercial applications?

Original Abstract Submitted

a power converter disclosed herein may include; a power module comprising at least one power semiconductor element; a metal plate being in thermal connection with the at least one power semiconductor element, and a flow path defining member including a plastic material and defining a coolant flow path together with the metal plate. a coolant may flow through the coolant flow path, and the flow path defining member may be integrated into the metal plate.