Tokyo electron limited (20240339431). BONDING METHOD AND BONDING SYSTEM simplified abstract
Contents
BONDING METHOD AND BONDING SYSTEM
Organization Name
Inventor(s)
Kazutaka Noda of Koshi City (JP)
Atsushi Nagata of Koshi City (JP)
Takashi Terada of Koshi City (JP)
BONDING METHOD AND BONDING SYSTEM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339431 titled 'BONDING METHOD AND BONDING SYSTEM
Simplified Explanation: The patent application describes a method for bonding substrates with exposed metal surfaces by modifying the surfaces with a plasma, hydrophilizing them, and then bonding them together.
- Modifying substrate surfaces with a plasma of a processing gas
- Hydrophilizing the modified surfaces
- Bonding the hydrophilized surfaces together
- Controlling the recess amount of the metal material with a processing liquid during hydrophilizing
Key Features and Innovation:
- Surface modification with plasma for bonding
- Hydrophilization of surfaces for improved adhesion
- Control of metal material recess amount during bonding process
Potential Applications: This technology can be used in semiconductor manufacturing, microelectronics, and other industries requiring precise bonding of substrates with metal surfaces.
Problems Solved: This method addresses the challenge of bonding substrates with exposed metal surfaces effectively and reliably.
Benefits:
- Enhanced bonding strength
- Improved adhesion between substrates
- Controlled recess amount of metal material for precise bonding
Commercial Applications: The technology can be applied in the production of electronic devices, sensors, and other high-tech products requiring precise substrate bonding with metal surfaces.
Prior Art: Researchers interested in this technology may explore prior art related to plasma surface modification, hydrophilization techniques, and methods for bonding substrates with metal surfaces.
Frequently Updated Research: Ongoing research in this field may focus on optimizing the bonding process for different types of substrates and metal materials.
Questions about Bonding Method of Substrates with Exposed Metal Surfaces: 1. How does the use of plasma surface modification improve the bonding process? 2. What are the potential challenges in controlling the recess amount of the metal material during bonding?
Original Abstract Submitted
a bonding method of bonding substrates, a metal material being exposed on each of the substrates, is provided. the bonding method includes modifying a surface of each of the substrates to be bonded with a plasma of a processing gas; hydrophilizing the modified surface of each of the substrates; and bonding the hydrophilized surfaces of the substrates. in the hydrophilizing of the modified surface, a processing liquid is supplied to the surface of each of the substrates, and a recess amount of the metal material is controlled with the processing liquid.
