Tokyo electron limited (20240339305). SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS simplified abstract
Contents
- 1 SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about the Technology
- 1.11 Original Abstract Submitted
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339305 titled 'SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Simplified Explanation
The patent application describes a substrate support and plasma processing apparatus designed to accurately place an edge ring on an electrostatic chuck. The substrate support includes a base with two regions: one for holding the substrate and another for holding the edge ring. The edge ring region has a positioning pin made of a material with a similar expansion coefficient to the chuck region.
- The substrate support has two regions: one for holding the substrate and another for holding the edge ring.
- The edge ring region includes a positioning pin made of a material with a similar expansion coefficient to the chuck region.
- The apparatus ensures high positional accuracy when placing the edge ring on the chuck.
Key Features and Innovation
- Accurate placement of an edge ring on an electrostatic chuck.
- Two distinct regions on the substrate support for holding the substrate and edge ring.
- Positioning pin made of a material with a similar expansion coefficient to ensure accuracy.
Potential Applications
- Semiconductor manufacturing
- Thin film deposition processes
- Plasma etching applications
Problems Solved
- Ensures precise positioning of the edge ring on the electrostatic chuck.
- Prevents misalignment during plasma processing.
Benefits
- Improved processing accuracy
- Enhanced substrate support stability
- Increased efficiency in plasma processing
Commercial Applications
- Semiconductor fabrication industry
- Thin film coating companies
- Research institutions in plasma technology
Questions about the Technology
How does the positioning pin contribute to the accuracy of placing the edge ring?
The positioning pin, made of a material with a similar expansion coefficient to the chuck region, ensures precise alignment of the edge ring on the electrostatic chuck, enhancing processing accuracy.
What are the potential implications of this technology in the semiconductor industry?
The technology can lead to improved efficiency and accuracy in semiconductor manufacturing processes, resulting in higher quality products and increased productivity.
Original Abstract Submitted
a substrate support and a plasma processing apparatus for placing an edge ring on an electrostatic chuck with high positional accuracy. a substrate support includes: a base, a first electrostatic chuck region disposed at an upper portion of the base and having a substrate support surface, and the first electrostatic chuck holding a substrate on the substrate support surface; and a second electrostatic chuck region disposed at the upper portion of the base to surround the first electrostatic chuck region and having a ring support surface, and the second electrostatic chuck holding an edge ring on the ring support surface. the second electrostatic chuck region is provided with a positioning pin of the edge ring, the positioning pin being formed of a material having a linear expansion coefficient substantially equal to a linear expansion coefficient of a material forming the second electrostatic chuck region.
