Tokyo electron limited (20240339303). SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS simplified abstract
Contents
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
Takashi Kanazawa of Miyagi (JP)
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240339303 titled 'SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
The abstract describes a substrate support system consisting of an electrostatic chuck, an edge ring, and a base. The electrostatic chuck has multiple regions with different functions, including supporting the substrate and the edge ring. It also includes electrodes and gas supply lines for operation.
- Electrostatic chuck with multiple regions for supporting substrate and edge ring
- Electrodes for applying DC voltage and bias power
- Gas supply line for gas distribution
- Edge ring and base for overall support structure
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar panel production
Problems Solved: - Ensuring stable and secure substrate support - Facilitating uniform deposition of materials - Enhancing overall process efficiency
Benefits: - Improved substrate handling and positioning - Enhanced control over deposition processes - Increased yield and quality of manufactured products
Commercial Applications: Title: Advanced Substrate Support System for Semiconductor Manufacturing This technology can be utilized in various industries such as semiconductor manufacturing, thin film deposition, and solar panel production. It offers improved substrate support, leading to enhanced process efficiency and product quality.
Prior Art: Researchers can explore prior patents related to substrate support systems, electrostatic chucks, and semiconductor manufacturing equipment to gain a deeper understanding of the technological advancements in this field.
Frequently Updated Research: Researchers and industry professionals can stay updated on the latest developments in substrate support systems, electrostatic chuck technology, and semiconductor manufacturing equipment through industry conferences, academic journals, and research publications.
Questions about Substrate Support Systems: 1. How does the electrostatic chuck contribute to the stability of substrate support? 2. What are the key advantages of using an edge ring in the substrate support system?
Original Abstract Submitted
a substrate support comprises an electrostatic chuck configured to support a substrate and an edge ring and a base configured to support the electrostatic chuck. the electrostatic chuck includes a first region having a first upper surface and configured to support a substrate placed on the first upper surface, a second region having a second upper surface and configured to support an edge ring placed on the second upper surface, a first electrode disposed in the first region and to which a dc voltage is applied, a second electrode disposed below the first electrode and to which a first bias power is supplied, a third electrode disposed below the second electrode and to which the first bias power is supplied and a first gas supply line disposed between the second electrode and the third electrode.
