Tokyo electron limited (20240335913). BONDING APPARATUS AND BONDING METHOD simplified abstract
Contents
BONDING APPARATUS AND BONDING METHOD
Organization Name
Inventor(s)
Tetsuya Maki of Koshi City (JP)
BONDING APPARATUS AND BONDING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240335913 titled 'BONDING APPARATUS AND BONDING METHOD
The bonding apparatus described in the abstract includes a first holder that attracts and holds a first substrate from above, a second holder that attracts and holds a second substrate from below, and mechanisms for moving and adjusting the position of the substrates.
- The first holder attracts and holds the first substrate from above, while the second holder does the same for the second substrate from below.
- A moving mechanism allows the holders to approach each other.
- A rough adjustment device positions the first substrate before it is held by the first holder.
- A fine adjustment device, including a driver that rotates the first holder using a piezoelectric element, finely adjusts the position of the first substrate.
Potential Applications: - Semiconductor manufacturing - Microelectronics assembly - Optoelectronics production
Problems Solved: - Precise alignment of substrates - Minimizing errors in bonding processes - Enhancing overall product quality
Benefits: - Improved accuracy in bonding - Increased efficiency in manufacturing processes - Enhanced product performance
Commercial Applications: Title: Precision Bonding Apparatus for Semiconductor Manufacturing This technology could be used in industries such as semiconductor manufacturing, microelectronics assembly, and optoelectronics production to enhance precision and efficiency in bonding processes.
Questions about Precision Bonding Apparatus: 1. How does the fine adjustment device contribute to the accuracy of the bonding process? The fine adjustment device, with its driver and piezoelectric element, allows for precise positioning of the substrate, ensuring accurate bonding.
2. What are the potential cost-saving benefits of using this bonding apparatus in semiconductor manufacturing? By minimizing errors and improving efficiency, this technology can lead to cost savings in production processes.
Original Abstract Submitted
a bonding apparatus includes a first holder configured to attract and hold a first substrate from above; a second holder located lower than the first holder and configured to attract and hold a second substrate from below; a moving mechanism configured to allow a first one of the first holder and the second holder to approach a second one of the first holder and the second holder; a rough adjustment device configured to roughly adjust a position in a rotational direction of the first substrate before the first substrate is attracted and held by the first holder; a fine adjustment device, including at least one first driver configured to rotate the first holder by displacing a piezoelectric element, configured to finely adjust, with the at least one first driver, the position in the rotational direction of the first substrate attracted and held by the first holder.
