Tokyo electron limited (20240249956). SUBSTRATE PROCESSING APPARATUS simplified abstract
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Yohei Nakagomi of Nirasaki City, Yamanashi (JP)
Ryo Kuwajima of Nirasaki City, Yamanashi (JP)
Yohei Midorikawa of Nirasaki City, Yamanashi (JP)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240249956 titled 'SUBSTRATE PROCESSING APPARATUS
The patent application describes a substrate processing apparatus with an inner chamber for accommodating the substrate, an outer chamber outside the inner chamber, and a processing gas supplier that provides processing gas to the inner chamber. The inner chamber can be detached from the outer chamber, which does not come into contact with the processing gas.
- The substrate processing apparatus includes an inner chamber for accommodating the substrate.
- An outer chamber is provided outside the inner chamber.
- A processing gas supplier is configured to supply processing gas to the inner chamber.
- The inner chamber can be detached from the outer chamber.
- The outer chamber does not come into contact with the processing gas supplied to the inner chamber.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar cell production
Problems Solved: - Contamination of the outer chamber by processing gas - Ease of maintenance and cleaning of the inner chamber - Enhanced substrate processing efficiency
Benefits: - Improved substrate processing quality - Reduced maintenance downtime - Enhanced overall equipment reliability
Commercial Applications: Title: Advanced Substrate Processing Apparatus for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance processing efficiency and improve product quality. The market implications include increased production output and reduced maintenance costs.
Questions about the technology: 1. How does the detachable inner chamber improve maintenance processes? 2. What are the specific advantages of the outer chamber not coming into contact with the processing gas?
Original Abstract Submitted
a substrate processing apparatus for processing a substrate, includes: an inner chamber in which the substrate is accommodated; an outer chamber provided outside the inner chamber, and a processing gas supplier configured to supply a processing gas to an interior of the inner chamber, wherein the inner chamber is configured to be detachable from the outer chamber, and the outer chamber is provided such that the outer chamber does not come into contact with the processing gas supplied to the interior of the inner chamber.
