Tokyo electron limited (20240249940). HEAT TREATMENT DEVICE AND TREATMENT METHOD simplified abstract
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HEAT TREATMENT DEVICE AND TREATMENT METHOD
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HEAT TREATMENT DEVICE AND TREATMENT METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240249940 titled 'HEAT TREATMENT DEVICE AND TREATMENT METHOD
The abstract describes a heat treatment device that includes a heating plate, a chamber, a gas supply, and an exhaust port for processing metal-containing resist films on a substrate.
- Heating plate supports and heats the substrate.
- Chamber covers the processing space above the heating plate.
- Gas supply delivers gas into the chamber along a path directed towards the substrate.
- Exhaust port evacuates the chamber.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Surface treatment of materials
Problems Solved: - Uniform heating of substrates - Precise control of gas flow for processing - Efficient evacuation of chamber gases
Benefits: - Improved film quality - Enhanced process control - Energy efficiency
Commercial Applications: Title: Advanced Heat Treatment Device for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to enhance the quality and efficiency of thin film deposition processes, leading to improved product performance and reliability.
Prior Art: Readers can explore prior art related to heat treatment devices in semiconductor manufacturing, such as patents on gas flow control systems and substrate heating methods.
Frequently Updated Research: Stay updated on the latest advancements in heat treatment devices for semiconductor manufacturing to ensure optimal process performance and product quality.
Questions about the technology: 1. How does this heat treatment device improve the quality of metal-containing resist films? - The device ensures uniform heating and precise gas flow control, resulting in improved film quality. 2. What are the potential cost savings associated with using this technology in semiconductor manufacturing? - The technology can lead to energy efficiency and process optimization, resulting in cost savings for manufacturers.
Original Abstract Submitted
a heat treatment device includes: a heating plate configured to support and heat a substrate on which a metal containing resist film is formed; a chamber configured to cover a processing space above the heating plate; a gas supply configured to supply a gas into the chamber along a gas flow path connected to an inside of the chamber, the gas flow path being directed toward the substrate; and an exhaust port configured to evacuate inside of the chamber.
