Tokyo electron limited (20240248413). SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS simplified abstract

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS

Organization Name

tokyo electron limited

Inventor(s)

Takeshi Shimoaoki of Koshi City (JP)

Arnaud Alain Jean Dauendorffer of Leuven (BE)

Keisuke Yoshida of Nirasaki City (JP)

Shinichiro Kawakami of Koshi City (JP)

Yuya Kamei of Koshi City, Kumamoto (JP)

Soichiro Okada of Leuven (BE)

Takafumi Niwa of Koshi City (JP)

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240248413 titled 'SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS

The substrate treatment method involves developing a substrate with an inorganic resist coating film, supplying an embedding solution to fill spaces between protrusions of the resist pattern, drying the solution to form an embedded film, and reducing its thickness with ultraviolet rays.

• Substrate treatment method involves developing a substrate with an inorganic resist coating film
• Supplying an embedding solution to fill spaces between protrusions of the resist pattern
• Drying the solution to form an embedded film on the substrate
• Reducing the thickness of the embedded film using ultraviolet rays

Potential Applications: This technology can be used in the semiconductor industry for creating intricate patterns on substrates.

Problems Solved: This method helps in achieving precise patterns on substrates with inorganic resist coatings.

Benefits: Enhanced precision in pattern formation on substrates, improved efficiency in semiconductor manufacturing processes.

Commercial Applications: This technology can be utilized in the production of microchips, integrated circuits, and other semiconductor devices.

Questions about Substrate Treatment Method: 1. How does the embedding solution fill the spaces between protrusions of the resist pattern? 2. What are the advantages of reducing the thickness of the embedded film with ultraviolet rays?

Original Abstract Submitted

a substrate treatment method includes: developing a substrate which has a coating film of an inorganic resist formed on a base film thereon and has been subjected to an exposure treatment, with a developing solution to form a pattern of the inorganic resist; supplying an embedding solution to the developed substrate to fill a space between adjacent protrusions of the pattern; drying the filled embedding solution to form an embedded film on the substrate; and reducing a thickness of the embedded film by an ultraviolet ray.