Tokyo electron limited (20240242988). PROCESSING APPARATUS AND ALIGNMENT METHOD simplified abstract
Contents
PROCESSING APPARATUS AND ALIGNMENT METHOD
Organization Name
Inventor(s)
Kiyoshi Mori of Fuchu City (JP)
PROCESSING APPARATUS AND ALIGNMENT METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240242988 titled 'PROCESSING APPARATUS AND ALIGNMENT METHOD
The patent application describes a processing apparatus with a processing container containing multiple processing spaces, a rotary arm with end effectors to hold wafers, and a sensor to detect the positions of the end effectors.
- The processing container has multiple processing spaces for wafers.
- The rotary arm, located centrally, holds end effectors that rotate around a shaft to hold wafers.
- A sensor detects the positions of the end effectors.
- One end effector at a specific position has a different shape from the others at that position.
Potential Applications: - Semiconductor manufacturing - Wafer processing industries - Automated processing systems
Problems Solved: - Efficient handling of multiple wafers - Precise positioning of wafers during processing
Benefits: - Increased productivity in wafer processing - Enhanced accuracy in wafer handling - Improved quality control in processing
Commercial Applications: Title: "Advanced Wafer Processing System for Semiconductor Industry" This technology can revolutionize semiconductor manufacturing processes by streamlining wafer handling and processing, leading to increased efficiency and quality control in the industry.
Questions about the technology: 1. How does the different shape of the end effector improve processing efficiency?
- The unique shape of the end effector at the sensor position allows for better detection and positioning accuracy.
2. What are the potential cost savings associated with implementing this processing apparatus in semiconductor manufacturing?
- The increased efficiency and accuracy can lead to reduced waste and rework, resulting in cost savings for manufacturers.
Original Abstract Submitted
a processing apparatus includes: a processing container having a plurality of processing spaces formed in the processing container; a rotary arm including a rotational shaft located at a central portion of the processing container and a plurality of end effectors configured to rotate around the rotational shaft and to hold a plurality of wafers which is equal in number to the plurality of processing spaces; and a sensor configured to detect positions of the plurality of end effectors. among the plurality of end effectors, at least one end effector at a position corresponding to the sensor has a different shape from shapes of other end effectors at the position corresponding to the sensor.
