Tokyo electron limited (20240240324). CARBON HARD MASK, FILM FORMING APPARATUS, AND FILM FORMING METHOD simplified abstract
Contents
CARBON HARD MASK, FILM FORMING APPARATUS, AND FILM FORMING METHOD
Organization Name
Inventor(s)
Hirotsugu Sugiura of Aichi (JP)
Tsuyoshi Moriya of Nirasaki-shi, Yamanashi (JP)
Satoshi Tanaka of Nirasaki-shi, Yamanashi (JP)
Yoshinori Morisada of Nirasaki-shi, Yamanashi (JP)
CARBON HARD MASK, FILM FORMING APPARATUS, AND FILM FORMING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240240324 titled 'CARBON HARD MASK, FILM FORMING APPARATUS, AND FILM FORMING METHOD
The abstract describes a patent application for a carbon hard mask laminated on an etching target film, with specific concentration ratios of methylene and methyl groups in the mask.
- The carbon hard mask has a concentration ratio of methylene and methyl groups that satisfies a specific expression.
- This innovation aims to improve the performance and durability of the hard mask during the etching process.
- The specific concentration ratio enhances the mask's ability to withstand etching conditions and maintain its integrity.
- By optimizing the chemical composition of the hard mask, the overall etching process can be more efficient and precise.
- This technology may have applications in semiconductor manufacturing, specifically in the fabrication of integrated circuits.
Potential Applications: - Semiconductor manufacturing - Integrated circuit fabrication
Problems Solved: - Enhancing the performance and durability of carbon hard masks during the etching process - Improving the precision and efficiency of etching in semiconductor manufacturing
Benefits: - Increased durability and performance of hard masks - Enhanced precision and efficiency in etching processes - Potential cost savings in semiconductor manufacturing
Commercial Applications: Title: Enhanced Carbon Hard Mask for Semiconductor Manufacturing This technology could be utilized in the production of integrated circuits, leading to more reliable and efficient semiconductor devices. The market implications include improved quality control and cost-effectiveness in manufacturing processes.
Questions about the technology: 1. How does the specific concentration ratio of methylene and methyl groups impact the performance of the carbon hard mask? 2. What are the potential long-term benefits of using this innovative hard mask in semiconductor manufacturing processes?
Frequently Updated Research: There may be ongoing research in the field of materials science and semiconductor manufacturing that explores the optimization of hard masks for etching processes. Stay updated on the latest developments to understand the evolving landscape of this technology.
Original Abstract Submitted
according to one embodiment, there is provided a carbon hard mask laminated on an etching target film, in which the concentration ratio of a methylene group chand a methyl group chcontained in the carbon hard mask satisfies the expression ch/(ch+ch)≥0.5.
