Tokyo Electron Limited patent applications published on September 12th, 2024
Summary of the patent applications from Tokyo Electron Limited on September 12th, 2024
1. 'Summary': Tokyo Electron Limited has recently filed patents for innovative semiconductor fabrication methods and apparatus. These patents involve techniques such as forming multilayered stacks with sacrificial layers, creating gate-all-around structures, and using ceramic materials for gas delivery tubes in semiconductor processing equipment. The bonding apparatus described in another patent ensures precise alignment and efficient bonding of substrates. Additionally, a substrate processing method involving two etching processes with varying rates has been patented.
2. 'Key Points of Patents':
- Fabrication method involving multilayered stacks with sacrificial layers and gate-all-around structures.
- Method for creating a forksheet semiconductor structure with insulation wall trenches.
- Semiconductor processing apparatus with ceramic gas delivery tubes and pedestal shaft.
- Bonding apparatus for precise alignment and bonding of substrates.
- Substrate processing method with two etching processes for different etching rates.
3. 'Notable Applications':
- Improved performance and efficiency in semiconductor devices.
- Enhanced insulation and structural integrity in semiconductor structures.
- Increased efficiency and reliability in semiconductor fabrication processes.
- Precise alignment and efficient bonding of delicate materials in microelectronics assembly.
- Higher quality semiconductor products and increased productivity in the industry.
Contents
- 1 Patent applications for Tokyo Electron Limited on September 12th, 2024
- 1.1 SUBSTRATE POSITIONING DEVICE, SUBSTRATE POSITIONING METHOD, AND BONDING APPARATUS (18595890)
- 1.2 DEPOSITION APPARATUS AND DEPOSITION METHOD (18583059)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (18589845)
- 1.4 ANTENNA AND PLASMA PROCESSING APPARATUS (18668645)
- 1.5 PLASMA PROCESSING APPARATUS, CONTROL METHOD, POWER SUPPLY SYSTEM, AND STORAGE MEDIUM (18665826)
- 1.6 FILTER CIRCUIT (18668416)
- 1.7 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18546140)
- 1.8 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18273116)
- 1.9 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18701058)
- 1.10 BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD (18598273)
- 1.11 Ceramic Pedestal Shaft with Heated/Cooled Gas Tube (18179503)
- 1.12 METHOD OF SELF-ALIGNED DIELECTRIC WALL FORMATION FOR FORKSHEET APPLICATION (18178665)
- 1.13 METHOD OF 3D CANTILEVER CHANNEL FORMATION (18182066)
Patent applications for Tokyo Electron Limited on September 12th, 2024
SUBSTRATE POSITIONING DEVICE, SUBSTRATE POSITIONING METHOD, AND BONDING APPARATUS (18595890)
Main Inventor
Tetsuya Maki
DEPOSITION APPARATUS AND DEPOSITION METHOD (18583059)
Main Inventor
Hiroki MURAKAMI
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (18589845)
Main Inventor
Tatsuya YAMAGUCHI
ANTENNA AND PLASMA PROCESSING APPARATUS (18668645)
Main Inventor
Hitoshi KATO
PLASMA PROCESSING APPARATUS, CONTROL METHOD, POWER SUPPLY SYSTEM, AND STORAGE MEDIUM (18665826)
Main Inventor
Chishio KOSHIMIZU
FILTER CIRCUIT (18668416)
Main Inventor
Yohei YAMAZAWA
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18546140)
Main Inventor
Miyako KANEKO
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18273116)
Main Inventor
Koji AKIYAMA
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS (18701058)
Main Inventor
Tsunemoto OGATA
BONDING APPARATUS, BONDING SYSTEM, AND BONDING METHOD (18598273)
Main Inventor
Kenji Sugakawa
Ceramic Pedestal Shaft with Heated/Cooled Gas Tube (18179503)
Main Inventor
Melvin Verbaas
METHOD OF SELF-ALIGNED DIELECTRIC WALL FORMATION FOR FORKSHEET APPLICATION (18178665)
Main Inventor
Eric Chih-Fang LIU
METHOD OF 3D CANTILEVER CHANNEL FORMATION (18182066)
Main Inventor
H. Jim FULFORD