Tokyo Electron Limited patent applications published on July 25th, 2024
Summary of the patent applications from Tokyo Electron Limited on July 25th, 2024
1. **Summary**: Tokyo Electron Limited has recently filed patents for innovative substrate processing methods, wafer handling apparatus, semiconductor device structures, and substrate transfer devices. These patents introduce advanced techniques for precise substrate manipulation, efficient wafer bonding, complex transistor designs, and streamlined substrate transfer in semiconductor manufacturing processes.
2. **Key Points of Patents**:
* The substrate processing method involves specific absorption layers for laser light manipulation. * The wafer handling apparatus ensures precise alignment and bonding during semiconductor manufacturing. * The semiconductor device features a complex channel structure transistor with enhanced performance. * The substrate transfer device includes a lift mechanism for efficient substrate transfer between processing modules.
3. **Notable Applications**:
* These patents can revolutionize the manufacturing of electronic devices, solar panels, and microelectronics. * They offer improved accuracy, efficiency, and control in semiconductor fabrication processes. * The technology can lead to cost savings, increased productivity, and higher-quality semiconductor products.
Contents
- 1 Patent applications for Tokyo Electron Limited on July 25th, 2024
- 1.1 TEMPERATURE CONTROL METHOD OF VAPORIZER AND SUBSTRATE PROCESSING APPARATUS (18417507)
- 1.2 SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS (18416087)
- 1.3 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (18412739)
- 1.4 UPPER ELECTRODE STRUCTURE AND PLASMA PROCESSING APPARATUS (18628269)
- 1.5 IN-SITU FOCUS RING COATING (18156917)
- 1.6 PLASMA PROCESSING APPARATUS (18628349)
- 1.7 Plasma Etching with Metal Sputtering (18156900)
- 1.8 HEAT TREATMENT DEVICE AND TREATMENT METHOD (18626475)
- 1.9 SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM (18418757)
- 1.10 SUBSTRATE PROCESSING APPARATUS (18566183)
- 1.11 SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD (18417564)
- 1.12 SUBSTRATE TRANSFER MECHANISM AND SUBSTRATE TRANSFERRING METHOD (18626565)
- 1.13 DEVICE AND METHOD OF FORMING 3D U-SHAPED NANOSHEET CFET (18159462)
- 1.14 COMPLIANT CHUCK EDGE RING (18530067)
- 1.15 SUBSTRATE PROCESSING METHOD (18562502)
Patent applications for Tokyo Electron Limited on July 25th, 2024
TEMPERATURE CONTROL METHOD OF VAPORIZER AND SUBSTRATE PROCESSING APPARATUS (18417507)
Main Inventor
Junichi HARADA
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT APPARATUS (18416087)
Main Inventor
Takeshi SHIMOAOKI
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD (18412739)
Main Inventor
Yoji SAKATA
UPPER ELECTRODE STRUCTURE AND PLASMA PROCESSING APPARATUS (18628269)
Main Inventor
Tetsuji SATO
IN-SITU FOCUS RING COATING (18156917)
Main Inventor
Minjoon Park
PLASMA PROCESSING APPARATUS (18628349)
Main Inventor
Ryota SAKANE
Plasma Etching with Metal Sputtering (18156900)
Main Inventor
Minjoon Park
HEAT TREATMENT DEVICE AND TREATMENT METHOD (18626475)
Main Inventor
Yohei SANO
SUBSTRATE TREATMENT METHOD, SUBSTRATE TREATMENT APPARATUS, AND COMPUTER STORAGE MEDIUM (18418757)
Main Inventor
Kosuke YOSHIHARA
SUBSTRATE PROCESSING APPARATUS (18566183)
Main Inventor
Yohei NAKAGOMI
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD (18417564)
Main Inventor
Shinsuke TAKAKI
SUBSTRATE TRANSFER MECHANISM AND SUBSTRATE TRANSFERRING METHOD (18626565)
Main Inventor
Kousei IDE
DEVICE AND METHOD OF FORMING 3D U-SHAPED NANOSHEET CFET (18159462)
Main Inventor
H. Jim FULFORD
COMPLIANT CHUCK EDGE RING (18530067)
Main Inventor
Christopher NETZBAND
SUBSTRATE PROCESSING METHOD (18562502)
Main Inventor
Yoshihisa MATSUBARA