Texas instruments incorporated (20250006607). SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS

SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS

Organization Name

texas instruments incorporated

Inventor(s)

John Carlo C. Molina of Limay PH

Nicole M. Yabuuchi of Angeles City PH

Ruby Ann M. Camenforte of Pampanga PH

SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS

This abstract first appeared for US patent application 20250006607 titled 'SEMICONDUCTOR PACKAGE WITH RETREATING METAL LAYERS

Original Abstract Submitted

a package comprises a die having a device side including circuitry. the package also comprises a substrate facing and coupled to the device side. the substrate includes first and second metal layers, the first metal layer positioned closer to the device side than the second metal layer and coupled to the second metal layer by way of a via. the substrate includes a dielectric contacting part of the first and second metal layers and the via. the package comprises a mold compound covering the semiconductor die and the substrate. the package includes a lateral surface perpendicular to the first and second metal layers of the substrate. the mold compound, the dielectric, and the second metal layer are exposed to the lateral surface, a segment of the dielectric positioned between the first metal layer and the lateral surface, the segment of the dielectric contacting the mold compound at the lateral surface.