Texas instruments incorporated (20240250060). CAPILLARY FOR STITCH BOND simplified abstract
Contents
CAPILLARY FOR STITCH BOND
Organization Name
texas instruments incorporated
Inventor(s)
CAPILLARY FOR STITCH BOND - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240250060 titled 'CAPILLARY FOR STITCH BOND
The abstract of the patent application describes a semiconductor package that includes a semiconductor die with a bond pad, a bond wire connecting the bond pad to a contact pad using a stitch bond with a plateau region, and a ramped portion.
- Simplified Explanation:
- The semiconductor package has a semiconductor die with a bond pad. - A bond wire connects the bond pad to a contact pad using a stitch bond with a plateau region. - The plateau region of the stitch bond forms an attachment to the contact pad.
- Key Features and Innovation:
- Semiconductor die with bond pad. - Bond wire connecting bond pad to contact pad. - Stitch bond with plateau region for attachment.
- Potential Applications:
- Semiconductor packaging in electronic devices. - Integrated circuits. - Microelectronics.
- Problems Solved:
- Secure attachment between bond wire and contact pad. - Efficient semiconductor packaging.
- Benefits:
- Improved reliability. - Enhanced performance. - Cost-effective manufacturing.
- Commercial Applications:
- Semiconductor industry. - Electronics manufacturing. - Consumer electronics market.
- Questions about Semiconductor Package:
1. How does the plateau region of the stitch bond improve attachment reliability? 2. What are the advantages of using a stitch bond in semiconductor packaging?
- Frequently Updated Research:
- Ongoing developments in semiconductor packaging technology. - Advances in bond wire attachment methods.
Original Abstract Submitted
an example semiconductor package comprises a semiconductor die having a top surface, a bond pad formed on the top surface, a bond wire having a first end and a second end, wherein the first end is attached to the bond pad. the semiconductor package having a contact pad, wherein the second end of the wire bond is attached to the contact pad by a stitch bond, the stitch bond having a plateau region formed between a cut end and a ramped portion, wherein a bottom surface of the plateau region forms an attachment to the contact pad.
