Texas instruments incorporated (20240178184). PROXIMITY SENSOR simplified abstract
Contents
- 1 PROXIMITY SENSOR
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PROXIMITY SENSOR - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PROXIMITY SENSOR
Organization Name
texas instruments incorporated
Inventor(s)
Sreenivasan Kalyani Koduri of DALLAS TX (US)
Leslie Edward Stark of Heath TX (US)
PROXIMITY SENSOR - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178184 titled 'PROXIMITY SENSOR
Simplified Explanation
The abstract describes a packaged integrated circuit (IC) with a lead frame, one or more semiconductor dies containing first and second circuits, and a molding compound encapsulating the lead frame and dies with cavities containing different materials.
- Lead frame: Provides structural support and electrical connections for the semiconductor dies.
- Semiconductor dies: Contain first and second circuits for electronic functions.
- Molding compound: Encapsulates the lead frame and dies, with cavities containing different materials for specific purposes.
Potential Applications
The technology could be applied in various electronic devices such as smartphones, computers, and automotive systems.
Problems Solved
This technology helps protect the semiconductor dies and provide structural integrity to the integrated circuit.
Benefits
- Enhanced protection for semiconductor dies - Improved reliability and durability of the integrated circuit
Potential Commercial Applications
"Advanced Packaging Technology for Integrated Circuits: Enhancing Durability and Reliability"
Possible Prior Art
Prior art may include similar packaging technologies used in the semiconductor industry.
Unanswered Questions
How does the different material in the cavities affect the performance of the integrated circuit?
The abstract does not provide details on how the different materials impact the functionality of the IC.
Are there any specific industries or applications where this technology would be most beneficial?
The abstract does not specify any particular industries or applications where this technology would be most advantageous.
Original Abstract Submitted
a packaged integrated circuit (ic), comprising: a lead frame; one or more semiconductor dies on the lead frame, the one or more semiconductor dies including a first circuit and a second circuit; and a molding compound encapsulating the lead frame and the semiconductor die, the molding compound including a first cavity over the first circuit and a second cavity over the second circuit, in which at least one of the first or second cavities includes a second material different from the molding compound.
