Texas instruments incorporated (20240178163). Slot Bow-Tie Antenna On Package simplified abstract
Contents
Slot Bow-Tie Antenna On Package
Organization Name
texas instruments incorporated
Inventor(s)
Rajen M. Murugan of Dallas TX (US)
Aditya Nitin Jogalekar of Dallas TX (US)
Slot Bow-Tie Antenna On Package - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178163 titled 'Slot Bow-Tie Antenna On Package
Simplified Explanation
The semiconductor package described in the abstract includes a semiconductor die with a passivation layer, a first metal layer with an antenna and transmission line, and a second metal layer functioning as a ground reflector. The antenna has a slot bow-tie configuration and is offset from the semiconductor die.
- Semiconductor package components:
- Semiconductor die with passivation layer - First metal layer with antenna and transmission line - Second metal layer as ground reflector
- Antenna features:
- Slot bow-tie configuration - Offset from semiconductor die
- Functionality:
- Transmission line couples semiconductor die to antenna - Insulating material separates first and second metal layers
- Potential Applications:
- Wireless communication devices - RFID tags - IoT devices
- Problems Solved:
- Improved signal transmission and reception - Enhanced antenna performance
- Benefits:
- Higher efficiency in wireless communication - Compact design for space-constrained applications
- Potential Commercial Applications:
- Mobile phones - Smart home devices - Wearable technology
- Possible Prior Art:
- Previous semiconductor packages with integrated antennas - Ground reflectors in antenna systems
- Unanswered Questions
- How does the slot bow-tie configuration of the antenna impact signal reception and transmission?
The slot bow-tie configuration of the antenna is designed to enhance signal reception and transmission by providing a balanced radiation pattern and improved impedance matching. This configuration helps in achieving better performance in wireless communication applications.
- What materials are typically used for the insulating material separating the first and second metal layers in semiconductor packages?
The insulating material used in semiconductor packages is often a dielectric material such as silicon dioxide or polyimide. These materials provide electrical insulation between the metal layers while maintaining mechanical stability and thermal performance.
Original Abstract Submitted
an example semiconductor package comprises a semiconductor die having a top surface, a passivation layer over the top surface, a first metal layer on the first passivation layer, an antenna formed in the first metal layer and offset from the semiconductor die, the antenna having a slot bow-tie configuration, a transmission line formed in the first metal layer, the transmission line coupling the semiconductor die to the antenna, and an insulating material separating the first metal layer from a second metal layer, the second metal layer configured to function as a ground reflector for the antenna. the second metal layer may extend below the antenna and the semiconductor die.
