Texas instruments incorporated (20240178085). OPEN CAVITY INTEGRATED CIRCUIT simplified abstract
Contents
- 1 OPEN CAVITY INTEGRATED CIRCUIT
OPEN CAVITY INTEGRATED CIRCUIT
Organization Name
texas instruments incorporated
Inventor(s)
STEVEN ALFRED Kummerl of Carrollton TX (US)
SREENIVASAN K. Koduri of Dallas TX (US)
SOPHIA Delpak of Richardson TX (US)
LAURA MAY ANTIONETTE Clemente of MABALACAT CITY (PH)
OPEN CAVITY INTEGRATED CIRCUIT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240178085 titled 'OPEN CAVITY INTEGRATED CIRCUIT
Simplified Explanation
The abstract describes an electronic device with a sensor encircled by a ring and covered by a mold compound, creating a cavity to expose the sensor to the external environment.
- The electronic device includes a substrate and a die with a sensor in communication with the active surface of the die.
- A ring surrounds the sensor, consisting of a cylindrical wall and a cap extending beyond the wall.
- A mold compound covers the die and forms a cavity to expose the sensor to the external environment.
Potential Applications
This technology could be used in various applications such as:
- Environmental monitoring
- Industrial automation
- Consumer electronics
Problems Solved
This technology helps in:
- Protecting the sensor from external elements
- Ensuring accurate sensor readings
- Enhancing the durability of the electronic device
Benefits
The benefits of this technology include:
- Improved sensor performance
- Increased reliability of the electronic device
- Extended lifespan of the sensor
Potential Commercial Applications
With its protective design and enhanced sensor performance, this technology could find commercial applications in:
- Automotive industry
- Aerospace sector
- Healthcare devices
Possible Prior Art
One possible prior art for this technology could be similar electronic devices with exposed sensors but lacking the protective ring and mold compound design.
Unanswered Questions
How does this technology compare to existing sensor protection methods in terms of cost-effectiveness?
This article does not provide information on the cost-effectiveness of this technology compared to other sensor protection methods. It would be beneficial to know if the added components increase the overall cost of the electronic device significantly.
What are the specific environmental conditions that the exposed sensor can withstand?
The abstract does not specify the environmental conditions that the exposed sensor can tolerate. It would be helpful to understand the range of conditions in which the sensor can operate effectively.
Original Abstract Submitted
an electronic device includes a substrate and a die having an active surface disposed on the substrate. a sensor is in communication with the active surface of the die. a ring encircles the sensor and includes a cylindrical wall and a cap, where the cap has a partial circular shape that extends beyond each side of the wall. a mold compound covers the die and abuts an outer surface of the wall thereby forming a cavity in the mold compound to expose the sensor to an environment external to the electronic device.
