Texas instruments incorporated (20240113065). DOUBLE STITCH WIREBONDS simplified abstract
Contents
- 1 DOUBLE STITCH WIREBONDS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DOUBLE STITCH WIREBONDS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to traditional bonding methods in terms of cost-effectiveness?
- 1.11 What are the potential challenges in scaling up the production of semiconductor packages using this technology?
- 1.12 Original Abstract Submitted
DOUBLE STITCH WIREBONDS
Organization Name
texas instruments incorporated
Inventor(s)
DOUBLE STITCH WIREBONDS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240113065 titled 'DOUBLE STITCH WIREBONDS
Simplified Explanation
The semiconductor package described in the abstract includes an electrically conductive surface and a bond wire coupled to the surface. The bond wire consists of a first stitch bond and a second stitch bond, with the second stitch bond partially overlapping the first stitch bond.
- The semiconductor package comprises an electrically conductive surface and bond wires.
- The bond wire includes a first stitch bond and a second stitch bond that partially overlaps the first stitch bond.
Potential Applications
The technology described in this patent application could be applied in various semiconductor devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved
This technology helps improve the electrical connectivity and reliability of semiconductor packages by utilizing multiple stitch bonds.
Benefits
The use of multiple stitch bonds in semiconductor packages can enhance the overall performance and longevity of electronic devices.
Potential Commercial Applications
The innovative semiconductor packaging technology could find applications in industries such as telecommunications, automotive, consumer electronics, and aerospace.
Possible Prior Art
One possible prior art could be the use of single stitch bonds in semiconductor packages, which may not provide the same level of electrical connectivity and reliability as the technology described in this patent application.
Unanswered Questions
How does this technology compare to traditional bonding methods in terms of cost-effectiveness?
The article does not provide information on the cost implications of implementing this technology compared to traditional bonding methods.
What are the potential challenges in scaling up the production of semiconductor packages using this technology?
The article does not address the scalability issues that may arise when implementing this technology on a larger scale for commercial production.
Original Abstract Submitted
in some examples, a semiconductor package comprises an electrically conductive surface and a bond wire coupled to the electrically conductive surface. the bond wire includes a first stitch bond coupled to the electrically conductive surface, and a second stitch bond contiguous with the first stitch bond and coupled to the electrically conductive surface. the second stitch bond is partially, but not completely, overlapping with the first stitch bond.
