Tesla, inc. (20240234333). WAFER ALIGNMENT STRUCTURE simplified abstract
Contents
WAFER ALIGNMENT STRUCTURE
Organization Name
Inventor(s)
Rishabh Bhandari of San Carlos CA (US)
Aydin Nabovati of Toronto (CA)
Ron Rosenberg of San Francisco CA (US)
Vijaykumar Krithivasan of Mountain View CA (US)
Mitchell Heschke of Los Altos CA (US)
WAFER ALIGNMENT STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234333 titled 'WAFER ALIGNMENT STRUCTURE
The abstract of the patent application describes a system on a wafer (SOW) assembly that includes two SOW assembly structures with different coefficients of thermal expansion (CTE). The first SOW assembly structure has slots at different locations, while the second SOW assembly structure is stacked on the first one and has pins extending from it that fit into the slots.
- The SOW assembly includes a first SOW assembly structure with a first CTE and slots at different locations.
- A second SOW assembly structure with a different CTE is stacked on the first one.
- The second structure has pins that fit into the slots of the first structure.
- The slots are shaped to allow the pins to move along different axes.
- The first structure can be a SOW, while the second structure can be a heat dissipation structure in certain applications.
Potential Applications: - Semiconductor manufacturing - Electronics industry - Thermal management systems
Problems Solved: - Addressing thermal expansion issues in wafer assemblies - Improving heat dissipation in electronic devices
Benefits: - Enhanced reliability of electronic components - Improved performance of semiconductor devices - Better thermal management in compact systems
Commercial Applications: - Semiconductor fabrication facilities - Electronic device manufacturers - Thermal management system providers
Questions about the technology: 1. How does the different coefficients of thermal expansion between the two SOW assembly structures impact the overall performance of the system? 2. What are the specific advantages of using a stacked SOW assembly structure for heat dissipation in electronic devices?
Frequently Updated Research: - Ongoing studies on optimizing thermal management in semiconductor devices - Research on advanced materials for improving heat dissipation in electronic systems
Original Abstract Submitted
a system on a wafer (sow) assembly is disclosed. the sow assembly can include a first sow assembly structure with a first coefficient of thermal expansion (cte). the first sow assembly structure includes first to third slots at different locations. the sow assembly can include a second sow assembly structure stacked on the first sow assembly structure. the second sow assembly structure has a second cte different from the first cte. the second sow assembly structure has first to third pins extending therefrom and disposed in the first to third slots. the first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. the first sow assembly structure can be a sow and the second sow assembly structure can be a heat dissipation structure in certain applications.
