Tesla, inc. (20240234243). ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE simplified abstract
Contents
ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE
Organization Name
Inventor(s)
Aydin Nabovati of Toronto (CA)
Mengzhi Pang of Cupertino CA (US)
Mohamed Nasr of Sunnyvale CA (US)
ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240234243 titled 'ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE
Simplified Explanation: The patent application discloses electronic assemblies, such as system on a wafer assemblies, that include an electronic component with a heat removing structure and a thermal interface structure for efficient heat dissipation.
Key Features and Innovation:
- Electronic component with a heat removing structure
- Thermal interface structure with thermal interface layer and adhesion layer
- System on a wafer (SOW) technology
- Lower pressure attachment of electronic component and heat removing structure
Potential Applications: This technology can be applied in various electronic devices requiring efficient heat dissipation, such as computers, smartphones, and servers.
Problems Solved: This technology addresses the issue of heat buildup in electronic components, which can lead to performance degradation and even failure.
Benefits:
- Improved heat dissipation
- Enhanced performance and reliability of electronic devices
- Simplified assembly process
Commercial Applications: Potential commercial applications include the manufacturing of high-performance electronic devices for industries such as telecommunications, aerospace, and automotive.
Prior Art: Readers can explore prior art related to thermal interface structures, heat dissipation technologies, and system on a wafer assemblies to understand the background of this innovation.
Frequently Updated Research: Stay updated on research related to thermal management in electronic devices, advancements in system on a wafer technology, and innovations in heat dissipation materials.
Questions about Electronic Assemblies: 1. What are the key components of the thermal interface structure? 2. How does the lower pressure attachment benefit the electronic assemblies?
1. A relevant generic question not answered by the article, with a detailed answer: How does the thermal interface structure improve the overall performance of electronic devices? The thermal interface structure enhances heat dissipation, preventing overheating and ensuring optimal performance of electronic components.
2. Another relevant generic question, with a detailed answer: What are the potential challenges in implementing system on a wafer technology in commercial electronic devices? Some challenges may include scalability, cost-effectiveness, and compatibility with existing manufacturing processes.
Original Abstract Submitted
electronic assemblies such as system on a wafer assemblies are disclosed. the assembly can include an electronic component that has a first side, a heat removing structure that is coupled to the first side of the electronic component, and a thermal interface structure that includes a thermal interface layer and an adhesion layer. the electronic component can be a system on a wafer (sow). the thermal interface layer is positioned between the first side of the electronic component and the heat dissipation structure. the adhesion layer is positioned between the heat removing structure and the thermal interface layer. with the thermal interface structure, the electronic component and the heat removing structure can be attached together with relatively lower pressure.
