Tesla, Inc. patent applications on March 6th, 2025
Patent Applications by Tesla, Inc. on March 6th, 2025
Tesla, Inc.: 2 patent applications
Tesla, Inc. has applied for patents in the areas of B62D1/04 (1), B60K35/25 (1), G06F3/01 (1), H01L23/00 (1), H01L23/473 (1) B62D1/046 (1), H01L24/05 (1)
With keywords such as: haptic, shape, mode, sensor, components, interface, thermal, feedback, switchpack, and during in patent application abstracts.
Patent Applications by Tesla, Inc.
20250074496. SYSTEM AND METHOD FOR HAPTIC CALIBRATION_simplified_abstract_(tesla, inc.)
Inventor(s): Michael Kessler of Los Gatos CA (US) for tesla, inc., Blane Frye of San Francisco CA (US) for tesla, inc., Tyler Sawatzky of Calgary (CA) for tesla, inc.
IPC Code(s): B62D1/04, B60K35/25, G06F3/01
CPC Code(s): B62D1/046
Abstract: a switchpack for a vehicle is provided that includes a haptic motor configured to provide haptic feedback to a user in a first mode of operation and provide haptic feedback to at least one sensor in a second mode of operation. the switchpack includes at least one sensor adapted to generate electric signals in response to force applied on the at least one sensor by the user during the first mode of operation. the at least one sensor is further configured to sense the haptic feedback provided by the haptic motor during the second mode of operation.
Inventor(s): Abel Misrak of Redwood City CA (US) for tesla, inc., Mohamed Nasr of Sunnyvale CA (US) for tesla, inc., Aydin Nabovati of Toronto (CA) for tesla, inc., Rishabh Bhandari of San Carlos CA (US) for tesla, inc.
IPC Code(s): H01L23/00, H01L23/473, H01L23/498, H01L25/065
CPC Code(s): H01L24/05
Abstract: aspects of this disclosure relate to a method of assembly that includes thermally coupling two components. the method includes providing a thermal interface pad between the two components, such as an integrated circuit and a cooling solution. the thermal interface pad can have a star shape, and a pressure is applied to at least one of the two components. the pressure can cause the star shape thermal interface to expand into a rectangular shape. the expanded rectangular shape does not expand into keep out area positioned around an electronic component of the two components.
