Tesla, Inc. patent applications on July 11th, 2024
Patent Applications by Tesla, Inc. on July 11th, 2024
Tesla, Inc.: 3 patent applications
Tesla, Inc. has applied for patents in the areas of B60K35/22 (1), B60K35/53 (1), H01L23/373 (1), H01L21/48 (1), H01L23/00 (1) B60K35/22 (1), H01L23/3735 (1), H01L23/544 (1)
With keywords such as: structure, sow, assembly, rotation, component, electronic, axis, third, thermal, and layer in patent application abstracts.
Patent Applications by Tesla, Inc.
20240227558. DUAL AXIS ROTATIONAL MECHANISM_simplified_abstract_(tesla, inc.)
Inventor(s): Ding Jin of Newark CA (US) for tesla, inc., Aneesh Kaliyanda of San Jose CA (US) for tesla, inc., Harold Mejia Ruiz of Palo Alto CA (US) for tesla, inc., Shakeel Theodore of Fremont CA (US) for tesla, inc.
IPC Code(s): B60K35/22, B60K35/53
CPC Code(s): B60K35/22
Abstract: generally described, one or more aspects of the present disclosure relate to the configuration and management of one or more components to facilitate dual axis rotation. more specifically, one or more aspects of the present application relate to the configuration or management of a rotation mechanism to facilitate the dual axis rotation of a display device. illustratively, the display device is mounted on rotation mechanism that facilitates a dual axis rotation utilizing a single actuator, dual rotation joints, and associated linkages. the rotation component further includes at least one additional floating joint that provides additional tension forces relative to a third axis. still further, in accordance with further embodiments, a control component can be utilized to generate control signals relating to rotation of the single actuators, such as establishing control positions and duty cycles.
Inventor(s): Aydin Nabovati of Toronto (CA) for tesla, inc., Mengzhi Pang of Cupertino CA (US) for tesla, inc., Mohamed Nasr of Sunnyvale CA (US) for tesla, inc.
IPC Code(s): H01L23/373, H01L21/48, H01L23/00
CPC Code(s): H01L23/3735
Abstract: electronic assemblies such as system on a wafer assemblies are disclosed. the assembly can include an electronic component that has a first side, a heat removing structure that is coupled to the first side of the electronic component, and a thermal interface structure that includes a thermal interface layer and an adhesion layer. the electronic component can be a system on a wafer (sow). the thermal interface layer is positioned between the first side of the electronic component and the heat dissipation structure. the adhesion layer is positioned between the heat removing structure and the thermal interface layer. with the thermal interface structure, the electronic component and the heat removing structure can be attached together with relatively lower pressure.
20240234333. WAFER ALIGNMENT STRUCTURE_simplified_abstract_(tesla, inc.)
Inventor(s): Yong guo Li of Gilroy CA (US) for tesla, inc., Rishabh Bhandari of San Carlos CA (US) for tesla, inc., Aydin Nabovati of Toronto (CA) for tesla, inc., Ron Rosenberg of San Francisco CA (US) for tesla, inc., Vijaykumar Krithivasan of Mountain View CA (US) for tesla, inc., Mitchell Heschke of Los Altos CA (US) for tesla, inc.
IPC Code(s): H01L23/544, H01L23/367
CPC Code(s): H01L23/544
Abstract: a system on a wafer (sow) assembly is disclosed. the sow assembly can include a first sow assembly structure with a first coefficient of thermal expansion (cte). the first sow assembly structure includes first to third slots at different locations. the sow assembly can include a second sow assembly structure stacked on the first sow assembly structure. the second sow assembly structure has a second cte different from the first cte. the second sow assembly structure has first to third pins extending therefrom and disposed in the first to third slots. the first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. the first sow assembly structure can be a sow and the second sow assembly structure can be a heat dissipation structure in certain applications.
