Tesla, Inc. patent applications on January 2nd, 2025
Patent Applications by Tesla, Inc. on January 2nd, 2025
Tesla, Inc.: 6 patent applications
Tesla, Inc. has applied for patents in the areas of H01L23/495 (3), H01L29/772 (3), H01L23/36 (2), H01L23/00 (2), B60W30/02 (1) B60W30/02 (1), G06N3/063 (1), H01L23/36 (1), H01L23/49562 (1), H01L23/49568 (1)
With keywords such as: semiconductor, die, lead, package, leads, neural, network, controllable, platform, and mode in patent application abstracts.
Patent Applications by Tesla, Inc.
20250002003. ADJUSTABLE SUSPENSION FOR A VEHICLE_simplified_abstract_(tesla, inc.)
Inventor(s): Joel Timothy Van Rooyen of Alameda CA (US) for tesla, inc., Brian Doorlag of San Francisco CA (US) for tesla, inc., Paul J. Venhovens of Redondo Beach CA (US) for tesla, inc.
IPC Code(s): B60W30/02, G06F16/9035
CPC Code(s): B60W30/02
Abstract: a system for dynamically managing individual suspension settings for a vehicle based on a determined suspension mode is provided. based on the user input and obtained sensor input, the system can then determine a suspension mode for a plurality of individually controllable components by specifying values or commands for each controllable component. a first mode may correspond to a lowering of the plurality of controllable. a second mode may correspond to lowering two controllable components corresponding to the rear wheels of the vehicle and raising two controllable components corresponding to front wheels of the vehicle. a third mode may correspond to a lowering of the plurality of controllable components to effectively drop the height of the vehicle to a threshold point. the system may further implement various validation processes that can validate the determined suspension mode and make further adjustment to individual controllable portions based on load or ground measurements.
Inventor(s): Michael Driscoll of Mountain View CA (US) for tesla, inc.
IPC Code(s): G06N3/063, G06F17/16, G06F18/20, G06F18/21, G06N3/08
CPC Code(s): G06N3/063
Abstract: systems and methods for adapting a neural network model on a hardware platform. an example method includes obtaining neural network model information comprising decision points associated with a neural network, with one or more first decision points being associated with a layout of the neural network. platform information associated with a hardware platform for which the neural network model information is to be adapted is accessed. constraints associated with adapting the neural network model information to the hardware platform are determined based on the platform information, with a first constraint being associated with a processing resource of the hardware platform and with a second constraint being associated with a performance metric. a candidate configuration for the neural network is generated via execution of a satisfiability solver based on the constraints, with the candidate configuration assigns values to the plurality of decision points.
Inventor(s): William Thomas Chi of Fremont CA (US) for tesla, inc., Utkarsh Raheja of Sunnyvale CA (US) for tesla, inc., Sesha Sai Srikant Sarma Gandikota of San Jose CA (US) for tesla, inc.
IPC Code(s): H01L23/36, H01L23/00, H01L23/04, H01L23/495, H01L29/772
CPC Code(s): H01L23/36
Abstract: the present disclosure relates to a semiconductor package with a pre-formed die clip and lead frame. the semiconductor package includes a semiconductor die, a heat spreader on a first side of the semiconductor die, a lead frame on a second side of the semiconductor die, and a die clip positioned between the semiconductor die and a portion of the lead frame. the die clip and the lead frame are pre-joined by way of various connection points.
20250006600. SEMICONDUCTOR PACKAGE WITH NESTED LEAD STRUCTURE_simplified_abstract_(tesla, inc.)
Inventor(s): William Thomas Chi of Fremont CA (US) for tesla, inc., Utkarsh Raheja of Sunnyvale CA (US) for tesla, inc., Sesha Sai Srikant Sarma Gandikota of San Jose CA (US) for tesla, inc.
IPC Code(s): H01L23/495, H01L23/00, H01L23/36, H01L29/66, H01L29/772
CPC Code(s): H01L23/49562
Abstract: the present disclosure relates to a semiconductor package. the semiconductor package includes a semiconductor die and a plurality of leads. the plurality of leads includes two drain leads connected to the drain, two source leads connected to the source, a gate lead connected to the gate, the gate lead positioned between the two source leads, and a sensing lead positioned between the two source leads. the two source leads, the gate lead, and the sensing lead are positioned on a first side of the semiconductor package that is opposite to a second side of the semiconductor package, and wherein the drain leads are positioned on the second side.
Inventor(s): William Thomas Chi of Fremont CA (US) for tesla, inc., Utkarsh Raheja of Sunnyvale CA (US) for tesla, inc., Sesha Sai Srikant Sarma Gandikota of San Jose CA (US) for tesla, inc., Steven Thomas Embleton of Austin TX (US) for tesla, inc.
IPC Code(s): H01L23/495, H01L23/31, H01L23/367, H01L25/18, H01L29/772
CPC Code(s): H01L23/49568
Abstract: the present disclosure relates to a semiconductor package. the semiconductor package includes a semiconductor die, molding material, and a conductive structure. the conductive structure is at least partly stacked with the semiconductor die, and the conductive structure includes a plurality of slots positioned around a point of the semiconductor die. the plurality of slots is configured to equalize thermal stresses during the operation of the semiconductor die about the point of the semiconductor die, where the thermal stresses are associated with coefficient of thermal expansion mismatches between the conductive structure and the molding material. in addition, at least a portion of the molding material is in contact with the conductive structure.
20250007267. COOLED BUSBAR FOR ELECTRIC POWER DISTRIBUTION_simplified_abstract_(tesla, inc.)
Inventor(s): Neil Prasad of Mountain View CA (US) for tesla, inc., Whitney Mathews of Mountain View CA (US) for tesla, inc., Jason Fishman of San Mateo CA (US) for tesla, inc.
IPC Code(s): H02G5/10, B60L53/16, B60L53/302
CPC Code(s): H02G5/10
Abstract: cooled busbars for electric power distribution are disclosed, in particular for electrical vehicles. the cooled busbar includes one or more conductive layers and one or more hollow portions (). a cooling medium, such as a liquid coolant, can flow through the hollow portion(s). the cooled busbar includes a rigid conductor (), an insulating layer () and a shielding layer ().
