Tesla, Inc. patent applications on April 25th, 2024
Patent Applications by Tesla, Inc. on April 25th, 2024
Tesla, Inc.: 1 patent applications
Tesla, Inc. has applied for patents in the areas of H01L23/544 (2), H01L23/367 (2), H01L2223/54426 (1)
With keywords such as: sow, assembly, structure, third, cte, slots, move, along, axis, and different in patent application abstracts.
Patent Applications by Tesla, Inc.
20240136303.WAFER ALIGNMENT STRUCTURE_simplified_abstract_(tesla, inc.)
Inventor(s): Yong guo Li of Gilroy CA (US) for tesla, inc., Rishabh Bhandari of San Carlos CA (US) for tesla, inc., Aydin Nabovati of Toronto (CA) for tesla, inc., Ron Rosenberg of San Francisco CA (US) for tesla, inc., Vijaykumar Krithivasan of Mountain View CA (US) for tesla, inc., Mitchell Heschke of Los Altos CA (US) for tesla, inc.
IPC Code(s): H01L23/544, H01L23/367
Abstract: a system on a wafer (sow) assembly is disclosed. the sow assembly can include a first sow assembly structure with a first coefficient of thermal expansion (cte). the first sow assembly structure includes first to third slots at different locations. the sow assembly can include a second sow assembly structure stacked on the first sow assembly structure. the second sow assembly structure has a second cte different from the first cte. the second sow assembly structure has first to third pins extending therefrom and disposed in the first to third slots. the first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. the first sow assembly structure can be a sow and the second sow assembly structure can be a heat dissipation structure in certain applications.
