Telefonaktiebolaget lm ericsson (publ) (20240243043). CIRCUITRY PACKAGE FOR POWER APPLICATIONS simplified abstract
Contents
CIRCUITRY PACKAGE FOR POWER APPLICATIONS
Organization Name
telefonaktiebolaget lm ericsson (publ)
Inventor(s)
David Sychaleun of Ottawa (CA)
Igor Acimovic of Gatineau (CA)
CIRCUITRY PACKAGE FOR POWER APPLICATIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240243043 titled 'CIRCUITRY PACKAGE FOR POWER APPLICATIONS
The abstract describes a patent application for a circuitry package positioned on a printed circuit board (PCB) with a heat sink provided. The circuitry package includes a body portion with a first surface, leads on a logical plane affixed to the first surface for contact with the PCB, and a central paddle for supporting transistor dies and acting as a thermal interface with the heat sink.
- The circuitry package is positioned on a PCB with a heat sink provided.
- The body portion of the circuitry package has a first surface.
- Leads on a logical plane are affixed to the first surface for contact with the PCB.
- A central paddle is affixed to the body portion and supports transistor dies near the logical plane.
- The central paddle acts as a thermal interface between the transistor dies and the heat sink.
Potential Applications: - Electronics manufacturing - Thermal management systems - Circuit board design
Problems Solved: - Improved heat dissipation for electronic components - Enhanced thermal performance in circuitry packages
Benefits: - Increased reliability of electronic devices - Extended lifespan of electronic components - Improved overall performance of electronic systems
Commercial Applications: Title: Enhanced Thermal Management System for Electronics This technology can be utilized in various industries such as telecommunications, automotive, and consumer electronics to improve the thermal performance and reliability of electronic devices.
Prior Art: Prior art related to this technology may include patents or research papers on thermal management systems for electronic components, circuit board design, and heat dissipation techniques.
Frequently Updated Research: Researchers are constantly exploring new materials and designs for heat sinks, circuitry packages, and thermal interfaces to enhance the performance and reliability of electronic devices.
Questions about Circuitry Package with Heat Sink: 1. How does the central paddle in the circuitry package improve thermal management? The central paddle in the circuitry package supports transistor dies near the logical plane and acts as a thermal interface with the heat sink, enhancing heat dissipation and overall thermal performance.
2. What are the potential applications of this technology beyond electronics manufacturing? This technology can also be applied in automotive systems, telecommunications equipment, and industrial machinery to improve thermal management and reliability.
Original Abstract Submitted
according to one or more embodiments, a circuitry package is positioned on a printed circuit board, (pcb) and a heat sink is provided. the circuitry package includes a body portion having a first surface, and a plurality of leads on a logical plane and affixed on the first surface of the body portion where the plurality of leads are positionable to make contact with the pcb. the circuitry package includes a central paddle affixed to the body portion and extending in a direction substantially perpendicular to the logical plane where the central paddle is configured to support at least one transistor die near the logical plane and act as a thermal interface between the at least one transistor die and the heat sink.
