Taiwan semiconductor manufacturing company, ltd. (20250070077). REFLOW METHOD AND SYSTEM

REFLOW METHOD AND SYSTEM

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Cheng-Shiuan Wong of Hsinchu (TW)

Ching-Hua Hsieh of Hsinchu (TW)

Hsiu-Jen Lin of Hsinchu County (TW)

Hao-Jan Pei of Hsinchu (TW)

Hsuan-Ting Kuo of Taichung City (TW)

Wei-Yu Chen of Taipei City (TW)

Chia-Shen Cheng of Hsinchu County (TW)

Philip Yu-Shuan Chung of Taipei (TW)

REFLOW METHOD AND SYSTEM

This abstract first appeared for US patent application 20250070077 titled 'REFLOW METHOD AND SYSTEM

Original Abstract Submitted

a system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. the stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. the first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. the energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.