Taiwan semiconductor manufacturing company, ltd. (20250062224). METHOD OF MANUFACTURING DEVICE DIE
Contents
METHOD OF MANUFACTURING DEVICE DIE
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Meng-Che Tu of Hsinchu city (TW)
Sih-Hao Liao of New Taipei City (TW)
Yu-Hsiang Hu of Hsinchu City (TW)
Hung-Jui Kuo of Hsinchu City (TW)
METHOD OF MANUFACTURING DEVICE DIE
This abstract first appeared for US patent application 20250062224 titled 'METHOD OF MANUFACTURING DEVICE DIE
Original Abstract Submitted
a package including a device die and an encapsulant is provided. the device die includes a semiconductor substrate, an interconnect structure, a conductive via, and a dielectric layer. the interconnect structure is disposed over the semiconductor substrate. the conductive via is disposed over and electrically coupled to the interconnect structure. the dielectric layer is disposed over the interconnect structure and laterally encapsulating the conductive via, wherein the dielectric layer includes a sidewall and a bottom surface facing the interconnect structure, and the sidewall of the dielectric layer is tilted with respect to the bottom surface of the dielectric layer. the encapsulant laterally encapsulates the device die.
