Taiwan semiconductor manufacturing company, ltd. (20250060542). PACKAGE HAVING PRISM STRUCTURE

PACKAGE HAVING PRISM STRUCTURE

Organization Name

taiwan semiconductor manufacturing company, ltd.

Inventor(s)

Che-Hsiang Hsu of Hsinchu (TW)

Chen-Hua Yu of Hsinchu City (TW)

Chung-Shi Liu of Hsinchu City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Cheng-Chieh Hsieh of Tainan (TW)

Hung-Yi Kuo of Taipei City (TW)

Tsung-Yuan Yu of Taipei City (TW)

Hua-Kuei Lin of Hsinchu city (TW)

Chung-Ming Weng of Hsinchu (TW)

PACKAGE HAVING PRISM STRUCTURE

This abstract first appeared for US patent application 20250060542 titled 'PACKAGE HAVING PRISM STRUCTURE

Original Abstract Submitted

a package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. the prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.