Taiwan semiconductor manufacturing company, ltd. (20240381787). TARGET FOR MRAM simplified abstract
Contents
TARGET FOR MRAM
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Wen-Hao Cheng of Taichung City (TW)
Hsuan-Chih Chu of Changhua County (TW)
Yen-Yu Chen of Taichung City (TW)
TARGET FOR MRAM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240381787 titled 'TARGET FOR MRAM
The patent application describes a sputtering target structure with a back plate and multiple sub-targets bonded to it. Each sub-target is smaller than the back plate and does not exceed a certain size to prevent crack formation during sputtering. The sub-targets are in direct contact with adjacent sub-targets.
- Sub-targets are smaller than the back plate and do not exceed a specific size threshold.
- Prevents crack formation during sputtering operations.
- Sub-targets are directly connected to neighboring sub-targets.
- Back plate provides structural support for the sub-targets.
- Enhances the efficiency and reliability of sputtering processes.
Potential Applications: - Thin film deposition in semiconductor manufacturing. - Coating processes in the automotive industry. - Solar panel production.
Problems Solved: - Prevents crack formation in sputtering targets. - Ensures uniform coating deposition. - Enhances the durability of sputtering equipment.
Benefits: - Improved sputtering process efficiency. - Enhanced product quality. - Extended equipment lifespan.
Commercial Applications: Title: "Advanced Sputtering Target Structure for Enhanced Thin Film Deposition" This technology can be used in semiconductor, automotive, and solar industries for thin film deposition and coating applications. It can lead to more efficient and reliable manufacturing processes, ultimately improving product quality and reducing production costs.
Prior Art: Researchers can explore prior patents related to sputtering target structures, thin film deposition, and coating technologies to understand the evolution of similar innovations in the field.
Frequently Updated Research: Researchers can stay updated on advancements in sputtering target structures, thin film deposition techniques, and coating technologies to enhance their understanding of the latest developments in the industry.
Questions about Sputtering Target Structures: 1. How does the size of sub-targets impact crack formation during sputtering operations? 2. What are the key advantages of using a back plate in a sputtering target structure?
Original Abstract Submitted
a sputtering target structure includes a back plate characterized by a first size and a plurality of sub-targets bonded to the back plate. each of the sub-targets is characterized by a size that is a fraction of the first size and is no greater than a threshold target size. a given sub-target characterized by a size no greater than the threshold target size exhibits no crack formation in a sputtering operation. each of the plurality of sub-targets is in direct contact with one or more adjacent sub targets.
