Taiwan semiconductor manufacturing company, ltd. (20240347412). HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT simplified abstract
Contents
HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT
Organization Name
taiwan semiconductor manufacturing company, ltd.
Inventor(s)
Hsin-Yen Huang of New Taipei City (TW)
Shao-Kuan Lee of Kaohsiung City (TW)
Hsiao-Kang Chang of Hsinchu City (TW)
Cherng-Shiaw Tsai of New Taipei City (TW)
HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240347412 titled 'HEAT DISPERSION LAYERS FOR DOUBLE SIDED INTERCONNECT
The abstract of this patent application describes an integrated chip with multiple layers designed to disperse heat efficiently.
- The chip includes a device layer with a first surface and a second surface.
- A first thermal dispersion layer is above the device layer, while a second thermal dispersion layer is below it.
- The first thermal conductivity of the first thermal dispersion layer differs from the second thermal conductivity of the second thermal dispersion layer.
Potential Applications: - This technology could be used in electronic devices such as smartphones, laptops, and tablets to improve thermal management. - It may also find applications in high-performance computing systems where heat dissipation is crucial.
Problems Solved: - Addresses the issue of heat buildup in electronic devices, which can affect performance and longevity. - Improves the overall efficiency and reliability of integrated chips by managing heat effectively.
Benefits: - Enhances the thermal performance of electronic devices. - Extends the lifespan of integrated chips by preventing overheating. - Improves overall system stability and reliability.
Commercial Applications: Title: Enhanced Thermal Management Technology for Electronic Devices This technology could be valuable for electronics manufacturers looking to improve the thermal performance of their products, leading to better customer satisfaction and potentially increased sales in the competitive market.
Questions about Integrated Chip Thermal Management: 1. How does the integration of multiple thermal dispersion layers improve heat dissipation in electronic devices?
- The integration of multiple thermal dispersion layers allows for more efficient heat transfer away from the device layer, reducing the risk of overheating.
2. What are the key factors to consider when designing thermal management solutions for integrated chips?
- Key factors include thermal conductivity of materials, layer thickness, and overall chip design to optimize heat dissipation and prevent thermal issues.
Original Abstract Submitted
various embodiments of the present disclosure are directed towards an integrated chip including a device layer including a first surface opposite a second surface. a first thermal dispersion layer overlies the device layer. a second thermal dispersion layer underlies the device layer. a first thermal conductivity of the first thermal dispersion layer is different from a second thermal conductivity of the second thermal dispersion layer.
